Abstract: In some aspects, a device includes side walls, a top wall, a floor, an interior space, and a back wall; a machine readable code device; at least one power connector configured to provide power to components of the material delivery device; at least one sensor configured to sense a physical characteristic associated with the material delivery device and/or the service element to generate, in part, device related information; a transceiver configured to transmit the device related information to a controller; and a holding mechanism arranged within the interior space and configured to receive and/or securely hold the service element.

Abstract: A dispensing system for dispensing a fluid material onto a substrate includes a jet dispenser configured to receive the fluid material therein, the jet dispenser having a jet cartridge operably connected thereto, the jet cartridge being configured to receive the fluid material from the jet dispenser and having a nozzle through which the fluid material is discharged towards the substrate; a camera configured to acquire a digital image of the jet dispenser; and a controller having a memory and a processor. The processor is configured to: identify, on the digital image of the jet dispenser, an identified pattern of features present on the jet dispenser; compare the identified pattern with a stored pattern, the stored pattern being stored in the memory; calculate the similarity between the identified pattern and the stored pattern; and provide an identifier value associated with the stored pattern.

Abstract: Systems and methods for two-component mixing in a jetting dispenser are provided herein. A jetting dispenser includes a fluid chamber having a first fluid inlet providing a first fluid and a second fluid inlet providing a second fluid, wherein the first fluid and the second fluid mix within the fluid chamber into a mixed fluid. A method for dispensing a mixed fluid from a dispenser having a fluid chamber in fluid communication with first and second fluid inlets is also provided. A first fluid is provided to the fluid chamber via the first fluid inlet and a second fluid is provided to the fluid chamber via the second fluid inlet. At least a portion of a valve element is moved relative to a valve seat to cause dynamic mixing of the first fluid and the second fluid within the fluid chamber to produce the mixed fluid that is dispensed.

Abstract: An apparatus for making three-dimensional objects comprises a movable dispensing head to dispense in a fluid state a supply of flexible strand of thermoplastic resin material. Two motors are provided for moving said dispensing head relative to a base member in an x, y plane in a predetermined sequence and pattern. A heater heats flexible strand to a predetermined temperature above the solidification temperature of said material.

Abstract: Systems and methods for two-component mixing in a jetting dispenser are provided herein. A jetting dispenser includes a fluid chamber having a first fluid inlet providing a first fluid and a second fluid inlet providing a second fluid, wherein the first fluid and the second fluid mix within the fluid chamber into a mixed fluid. A method for dispensing a mixed fluid from a dispenser having a fluid chamber in fluid communication with first and second fluid inlets is also provided. A first fluid is provided to the fluid chamber via the first fluid inlet and a second fluid is provided to the fluid chamber via the second fluid inlet. At least a portion of a valve element is moved relative to a valve seat to cause dynamic mixing of the first fluid and the second fluid within the fluid chamber to produce the mixed fluid that is dispensed.

Abstract: An apparatus for making three-dimensional physical objects of predetermined shape by sequentially depositing multiple layers of solidifying material on a base member in a desired pattern, the apparatus comprising: a movable dispensing head (112) having a flow passage (124) therein in flow communication at one end thereof with a dispensing outlet configured in the form of a tip with a discharge orifice (126) of predetermined size therein to dispense material in a fluid state; a supply of flexible strand of thermoplastic resin material that solidifies by cooling to a solidification temperature; heated relatively rapidly to a temperature just above its solidification temperature and will solidify due to a drop in temperature upon being dispensed onto said base member.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere.

Abstract: A voltage isolation device for controlling the flow of conductive liquid between a liquid supply source and a liquid destination source. The isolation device has an inlet connected to the supply source and has a yoke slide valve positionable along a pair of rods; one of the rods engages a slideable tube at the inlet to provide a liquid seal and the yoke slide valve may be positionable to slide the tube away from the rod to thereby provide a flow path for liquid through the tube and out the slide valve. A pair of seal assemblies each having axially spaced apart seals have formed sealing areas containing a non-conductive seal liquid which is capable of dissolving the conductive liquids being utilized. A scheme is provided to route arcs which result when the charged fluid is connected to the grounded fluid so as to locate the arc away from parts which could be damaged by it.