Patents by Inventor David PAI

David PAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230020438
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: September 21, 2022
    Publication date: January 19, 2023
    Applicant: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 11488865
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: November 1, 2022
    Assignee: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 10741447
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: August 11, 2020
    Assignee: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 10707060
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: July 7, 2020
    Assignee: Plasma-Therm LLC
    Inventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman, Gordon M. Grivna
  • Patent number: 10573557
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: February 25, 2020
    Assignee: Plasma-Therm LLC
    Inventors: David Pays-Volard, Linnell Martinez, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 10497621
    Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: December 3, 2019
    Assignee: Plasma-Therm LLC
    Inventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
  • Publication number: 20190244859
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: April 11, 2019
    Publication date: August 8, 2019
    Applicant: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 10297427
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: May 21, 2019
    Assignee: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 10283327
    Abstract: An apparatus for generating a flow of reactive gas for decontaminating a material, surface or area, comprises a first electrode member comprising a first plurality of conductive surfaces and a second electrode member comprising a second plurality of conductive surfaces. The second electrode member is arranged in spaced relationship with the first electrode member to define a reactor channel. The conductive surfaces are exposed to the reactor channel so as to form air gaps between the first plurality of conductive surfaces and the second plurality of conductive surfaces. An air blower generates a flow of air through the reactor channel.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: May 7, 2019
    Assignees: The Board of Trustees of the Leland Stanford Junior University, CentraleSupélec
    Inventors: Christophe O. Laux, Johan O. Andreasson, Luke C. Raymond, Diane Rusterholtz-Duval, David Pai, Deanna Lacoste, Florent Sainct, Sebastien Mannai, Florian Girschig, Pierpaolo Toniato, Erwan Pannier, Augustin Tibère-Inglesse
  • Publication number: 20190013243
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: September 14, 2018
    Publication date: January 10, 2019
    Applicant: Plasma-Therm LLC
    Inventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman, Gordon M. Grivna
  • Publication number: 20180254215
    Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.
    Type: Application
    Filed: May 6, 2016
    Publication date: September 6, 2018
    Applicant: Plasma-Therm, LLC
    Inventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
  • Publication number: 20180190542
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: March 2, 2018
    Publication date: July 5, 2018
    Applicant: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Publication number: 20180187196
    Abstract: The present invention provides methods of treatment using inhibitors of DEK protein and DEK activity. Such methods include, but are not limited to, methods of preventing, treating, and/or ameliorating inflammatory diseases, infections, autoimmune diseases, malignant diseases, and other diseases or conditions in which DEK has been implicated. Such inhibitors of DEK protein include, but are not limited to, pharmaceutical compositions including single stranded DNA or RNA aptamers capable of binding to DEK. In some embodiments, such aptamers are useful for diagnosing DEK related diseases or conditions. Related kits and compositions are further provided.
    Type: Application
    Filed: March 11, 2016
    Publication date: July 5, 2018
    Inventors: David MARKOVITZ, Nirit MOR-VAKNIN, Maureen LEGENDRE, David ENGELKE, Kristine ANGEVINE, David PAI
  • Patent number: 9911654
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: March 6, 2018
    Assignee: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 9711406
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: July 18, 2017
    Assignee: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Patent number: 9564366
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: February 7, 2017
    Assignee: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Publication number: 20170033008
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: October 6, 2016
    Publication date: February 2, 2017
    Applicant: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Publication number: 20170025311
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: October 6, 2016
    Publication date: January 26, 2017
    Applicant: Plasma-Therm LLC
    Inventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
  • Publication number: 20170018410
    Abstract: An apparatus for generating a flow of reactive gas for decontaminating a material, surface or area, comprises a first electrode member comprising a first plurality of conductive surfaces and a second electrode member comprising a second plurality of conductive surfaces. The second electrode member is arranged in spaced relationship with the first electrode member to define a reactor channel. The conductive surfaces are exposed to the reactor channel so as to form air gaps between the first plurality of conductive surfaces and the second plurality of conductive surfaces. An air blower generates a flow of air through the reactor channel.
    Type: Application
    Filed: June 24, 2016
    Publication date: January 19, 2017
    Inventors: Christophe O. LAUX, Johan O. ANDREASSON, Luke C. RAYMOND, Diane RUSTERHOLTZ-DUVAL, David PAI, Deanna LACOSTE, Florent SAINCT, Sebastien MANNAI, Florian GIRSCHIG, Pierpaolo TONIATO, Erwan PANNIER, Augustin TIBÈRE-INGLESSE
  • Patent number: RE46339
    Abstract: The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: March 14, 2017
    Assignee: Plasma-Therm LLC
    Inventors: Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Russell Westerman, Gordon Grivna