Patents by Inventor David PAI
David PAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230020438Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: September 21, 2022Publication date: January 19, 2023Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 11488865Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: April 11, 2019Date of Patent: November 1, 2022Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 10741447Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: March 2, 2018Date of Patent: August 11, 2020Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 10707060Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: September 14, 2018Date of Patent: July 7, 2020Assignee: Plasma-Therm LLCInventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman, Gordon M. Grivna
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Patent number: 10573557Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: June 3, 2015Date of Patent: February 25, 2020Assignee: Plasma-Therm LLCInventors: David Pays-Volard, Linnell Martinez, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 10497621Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: GrantFiled: May 6, 2016Date of Patent: December 3, 2019Assignee: Plasma-Therm LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Publication number: 20190244859Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: April 11, 2019Publication date: August 8, 2019Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 10297427Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: September 1, 2015Date of Patent: May 21, 2019Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 10283327Abstract: An apparatus for generating a flow of reactive gas for decontaminating a material, surface or area, comprises a first electrode member comprising a first plurality of conductive surfaces and a second electrode member comprising a second plurality of conductive surfaces. The second electrode member is arranged in spaced relationship with the first electrode member to define a reactor channel. The conductive surfaces are exposed to the reactor channel so as to form air gaps between the first plurality of conductive surfaces and the second plurality of conductive surfaces. An air blower generates a flow of air through the reactor channel.Type: GrantFiled: June 24, 2016Date of Patent: May 7, 2019Assignees: The Board of Trustees of the Leland Stanford Junior University, CentraleSupélecInventors: Christophe O. Laux, Johan O. Andreasson, Luke C. Raymond, Diane Rusterholtz-Duval, David Pai, Deanna Lacoste, Florent Sainct, Sebastien Mannai, Florian Girschig, Pierpaolo Toniato, Erwan Pannier, Augustin Tibère-Inglesse
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Publication number: 20190013243Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: September 14, 2018Publication date: January 10, 2019Applicant: Plasma-Therm LLCInventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman, Gordon M. Grivna
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Publication number: 20180254215Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: ApplicationFiled: May 6, 2016Publication date: September 6, 2018Applicant: Plasma-Therm, LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Publication number: 20180190542Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: March 2, 2018Publication date: July 5, 2018Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20180187196Abstract: The present invention provides methods of treatment using inhibitors of DEK protein and DEK activity. Such methods include, but are not limited to, methods of preventing, treating, and/or ameliorating inflammatory diseases, infections, autoimmune diseases, malignant diseases, and other diseases or conditions in which DEK has been implicated. Such inhibitors of DEK protein include, but are not limited to, pharmaceutical compositions including single stranded DNA or RNA aptamers capable of binding to DEK. In some embodiments, such aptamers are useful for diagnosing DEK related diseases or conditions. Related kits and compositions are further provided.Type: ApplicationFiled: March 11, 2016Publication date: July 5, 2018Inventors: David MARKOVITZ, Nirit MOR-VAKNIN, Maureen LEGENDRE, David ENGELKE, Kristine ANGEVINE, David PAI
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Patent number: 9911654Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: October 6, 2016Date of Patent: March 6, 2018Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 9711406Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: October 6, 2016Date of Patent: July 18, 2017Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 9564366Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: December 18, 2015Date of Patent: February 7, 2017Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20170033008Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: October 6, 2016Publication date: February 2, 2017Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20170025311Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: October 6, 2016Publication date: January 26, 2017Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20170018410Abstract: An apparatus for generating a flow of reactive gas for decontaminating a material, surface or area, comprises a first electrode member comprising a first plurality of conductive surfaces and a second electrode member comprising a second plurality of conductive surfaces. The second electrode member is arranged in spaced relationship with the first electrode member to define a reactor channel. The conductive surfaces are exposed to the reactor channel so as to form air gaps between the first plurality of conductive surfaces and the second plurality of conductive surfaces. An air blower generates a flow of air through the reactor channel.Type: ApplicationFiled: June 24, 2016Publication date: January 19, 2017Inventors: Christophe O. LAUX, Johan O. ANDREASSON, Luke C. RAYMOND, Diane RUSTERHOLTZ-DUVAL, David PAI, Deanna LACOSTE, Florent SAINCT, Sebastien MANNAI, Florian GIRSCHIG, Pierpaolo TONIATO, Erwan PANNIER, Augustin TIBÈRE-INGLESSE
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Patent number: RE46339Abstract: The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma.Type: GrantFiled: September 15, 2015Date of Patent: March 14, 2017Assignee: Plasma-Therm LLCInventors: Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Russell Westerman, Gordon Grivna