Patents by Inventor David Paul Banasek

David Paul Banasek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11083099
    Abstract: A circuit board includes a first locking mechanism configured to secure the circuit board to a chassis. The circuit board also includes a connector disposed at an inboard end of the circuit board. The connector is configured to be electrically connected to a mating connector on either a backplane or a circuit board. The circuit board also includes a second locking mechanism. The second locking mechanism is configured to secure the connector of the circuit board to the mating connector of the backplane or the circuit card.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: August 3, 2021
    Assignee: SMART Embedded Computing, Inc.
    Inventors: Christopher M. Madsen, David Paul Banasek
  • Publication number: 20210136939
    Abstract: A circuit board includes a first locking mechanism configured to secure the circuit board to a chassis. The circuit board also includes a connector disposed at an inboard end of the circuit board. The connector is configured to be electrically connected to a mating connector on either a backplane or a circuit board. The circuit board also includes a second locking mechanism. The second locking mechanism is configured to secure the connector of the circuit board to the mating connector of the backplane or the circuit card.
    Type: Application
    Filed: October 30, 2019
    Publication date: May 6, 2021
    Inventors: Christopher M. MADSEN, David Paul BANASEK
  • Patent number: 7957138
    Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: June 7, 2011
    Assignee: Emerson Network Power - Embedded Computing, Inc.
    Inventors: Pasi Jukka Vaananen, Stephen A. Hauser, David Paul Banasek
  • Publication number: 20100220456
    Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.
    Type: Application
    Filed: October 16, 2009
    Publication date: September 2, 2010
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventors: Pasi Jukka Vaananen, Stephen A. Hauser, David Paul Banasek