Patents by Inventor David Paul Trauenicht

David Paul Trauenicht has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140242297
    Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Inventors: Hwei-Ling Yau, David Paul Trauenicht, John Andrew Lebens, Yongcai Wang, Ronald Steven Cok