Patents by Inventor David Pedder

David Pedder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microchip module assemblies
    Patent number: 5784261
    Abstract: Low profile microchip module assemblies are formed by first mounting one or more active semiconductor integrated circuit chips on a multilayer metallization and dielectric structure on a substrate of, say, silicon or alumina, by wire bonding or flip-chip solder bonding, and then inverting the substrate and mounting it on a printed circuit board by means of solder bump connections. The solder bump connections are sufficiently high for the chips to be held clear of the printed circuit board.
    Type: Grant
    Filed: January 31, 1996
    Date of Patent: July 21, 1998
    Assignee: Plessey Semiconductors Limited
    Inventor: David Pedder