Abstract: The present disclosure relates to ligand-payload conjugates, and compositions and use thereof for treating diseases, disorders, or conditions, such as cancers, autoimmune diseases, or infectious diseases. The present disclosure also provides methods of synthesizing ligand-payload conjugates, and related intermediates.

Abstract: The present disclosure provides flow cytometry system. The flow cytometry system includes a flow cell, a fluidic pathway in fluid communication with the flow cell, and a probe in fluid communication with the fluidic pathway. The probe is configured to input a plurality of samples and aliquots of a separation gas between successive ones of the plurality of samples into the fluidic pathway. The flow cytometry system also includes two or more lasers positioned such that an illumination spot of each of the two or more lasers is directly on the flow cell, and two or more side scatter detection modules in communication with the two or more lasers. The flow cytometry system also includes a processor in communication with the two or more side scatter detection modules, and a non-transitory computer readable medium having stored therein instructions that are executable to cause the processor to perform functions when using the flow cytometer system.

Abstract: A feeder for a swage gun comprises a collar magazine and a guide-block assembly. The guide-block assembly comprises a guide block that comprises a slot, configured to receive the lock collar from the collar magazine at a first guide-block position along the slot. The guide-block assembly also comprises an actuator, operable to move the lock collar along the slot from the first guide-block position to a second guide-block position. Feeder further comprises a feed tunnel, coupled with the guide-block assembly, and a dispensing bulkhead, coupled with the feed tunnel. Feeder also comprises a gripping assembly, coupled with the dispensing bulkhead.

Abstract: An effective sensor for indicating exposure to a toxic gas includes a non-conductive, inert substrate such as glass or polyethylene, a two-dimensional film of nanoparticles of a conductive metal such as silver or copper on the substrate and an electrode connected to each end of the film. When an electrical current passes through the film and the sensor is exposed to a toxic gas, changes in the electrical resistance of the film provides an indication of the presence of the toxic gas.

Abstract: An effective sensor for indicating exposure to a toxic gas includes a non-conductive, inert substrate such as glass or polyethylene, a two-dimensional film of nanoparticles of a conductive metal such as silver or copper on the substrate and an electrode connected to each end of the film. When an electrical current passes through the film and the sensor is exposed to a toxic gas, changes in the electrical resistance of the film provides an indication of the presence of the toxic gas.

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract: Methods for processing at least one die which comprises an integrated circuit. In one example of a method of the invention, an identification code is applied to a carrier. A singulated die is deposited into the carrier which holds the singulated die. The singulated die comprises an integrated circuit. The identification code may be applied to the carrier before or after depositing the singulated die into the carrier. The carrier may be used in testing the singulated die and may include a plurality of singulated die or just one singulated die. In another example of a method of the invention, an identification code is applied to a die. The die is deposited into a carrier which holds the die. The die comprises an integrated circuit, and the carrier holds the die in singulated form. Typically the die is placed in the carrier without any packaging which may protect the die. The identification code may be applied to the die before or after it is deposited into the carrier.

Abstract: Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. Physical alignment techniques are also described.

Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: A clutch assembly is provided including a first member and a second member rotatable relative to the first member. A clutch pack is provided for frictionally engaging the first and second members. A piston chamber is provided adjacent to the clutch pack, and a piston is disposed in the piston chamber and operable for applying axial pressure to the clutch pack. The piston includes first, second, and third seal portions integrally molded in place on the piston and engaging the piston chamber at spaced locations. The integrally molded first, second, and third seal portions reduce the number of components necessary for properly sealing the piston chamber and reduce the amount of labor required for assembly.

Abstract: Embodiments of the invention provide methods and apparatuses for implementing telemetry applications with the SIM card of a mobile equipment. For one embodiment of the invention the telemetry application allows the encoding of TAD within a supplementary services message and transmission of the TAD over a control channel of a GMS telecommunications system. For one embodiment of the invention the telemetry application allows the decoding of caller identification message received from a CMS to obtain the TAD.

Abstract: One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads.

Abstract: A clutch assembly is provided including a first member and a second member rotatable relative to the first member. A clutch pack is provided for frictionally engaging the first and second members. A piston chamber is provided adjacent to the clutch pack, and a piston is disposed in the piston chamber and operable for applying axial pressure to the clutch pack. The piston includes first, second, and third seal portions integrally molded in place on the piston and engaging the piston chamber at spaced locations. The integrally molded first, second, and third seal portions reduce the number of components necessary for properly sealing the piston chamber and reduce the amount of labor required for assembly.

Abstract: One embodiment of the present invention concerns a test assembly for testing product circuitry of a product die. In one embodiment, the test assembly includes at test die and an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die. The test die may be designed according to a design methodology that includes the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry can be designed to provide a high degree of fault coverage for the corresponding product circuitry generally without regard to the amount of silicon area that will be required by the test circuitry. The design methodology then partitions the unified design into the test die and the product die. The test die includes the test circuitry and the product die includes the product circuitry. The product and test die may then be fabricated on separate semiconductor wafers.

Abstract: Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. Physical alignment techniques are also described.

Abstract: A method and system for allocating distributed resources connected to a computer network to application programs running on computers attached to the communications network. The distributed resource allocator system comprises a number of identical processes running on one or more computers attached to the communications network. Application programs request allocation of resources from a local distributed resource allocator system process running using a resource allocator applications programming interface. Application programs request allocation of resource from a remote distributed resource allocator system process via a resource allocator access protocol. The distributed resource allocator system is fault-tolerant and provides contention control and load balancing. The resource allocator system also manages information about the capacities and capabilities of resources connected to the communications network.

Abstract: A method and system for resolving contending requests for resources connected from a computer network by application programs running on computers attached to the communications network. The distributed resource allocator system comprises a number of identical processes running on one or more computers attached to the communications network. Application programs request allocation of resources from a local distributed resource allocator system process running using a resource allocator applications programming interface. Application programs request allocation of resource from a remote distributed resource allocator system process via a resource allocator access protocol. Contending resource requests are first resolved by the priority of the resource request. If contention cannot be resolved by priority alone, then contentions are next resolved by examining the resource request's time of arrival in light of its priority.

Abstract: A method and system for allocating distributed resources connected to a computer network to application programs running on computers attached to the communications network. The distributed resource allocator system comprises a number of identical processes running on one or more computers attached to the communications network. Application programs request allocation of resources from a local distributed resource allocator system process running using a resource allocator applications programming interface. Application programs request allocation of resource from a remote distributed resource allocator system process via a resource allocator access protocol. The distributed resource allocator system provides a means for the entry of new resources and new resource class and characteristics information in a shared directory. The resource allocator system also manages information about the capacities and capabilities of resources connected to the communications network.

Abstract: There is provided a soluble chemical layer affixed to a rigid backing, whereupon an electronic configuration is printed and covered with a lacquer. The pattern and lacquer coating are then separated from the backing by dissolving the soluble chemical. Once free, the pattern is transferred to and fused to the substrate.