Abstract: In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.

Abstract: In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.

Abstract: In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.

Abstract: In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.

Abstract: An exemplary system and method for providing an acoustic plate wave apparatus is disclosed as comprising inter alia: a monocrystalline silicon substrate (200); an amorphous oxide material (220); a monocrystalline perovskite oxide material (230); a monocrystalline piezoelectric material (240); and a flexural plate wave component (250, 270) having an input interdigitated transducer (270), an output interdigitated transducer (250) and an optional support layer (260). Deposition or removal of material on or from an absorptive thin film sensor surface (210), or changes in the mechanical properties of the thin film (210) in contact with various chemical species, or changes in the electrical characteristics of a solvent solution exposed to the thin film (210) generally operate to produce measurable perturbations in the vector quantities (e.g., velocity, etc.) and scalar quantities (e.g., attenuation, etc.) of the acoustic plate modes.

Abstract: An exemplary system and method for providing an acoustic plate wave apparatus is disclosed as comprising inter alia: a monocrystalline silicon substrate (200); an amorphous oxide material (220); a monocrystalline perovskite oxide material (230); a monocrystalline piezoelectric material (240); and a flexural plate wave component (250, 270) having an input interdigitated transducer (270), an output interdigitated transducer (250) and an optional support layer (260). Deposition or removal of material on or from an absorptive thin film sensor surface (210), or changes in the mechanical properties of the thin film (210) in contact with various chemical species, or changes in the electrical characteristics of a solvent solution exposed to the thin film (210) generally operate to produce measurable perturbations in the vector quantities (e.g., velocity, etc.) and scalar quantities (e.g., attenuation, etc.) of the acoustic plate modes.

Abstract: High quality epitaxial layers of monocrystalline piezoelectric materials and compound semiconductor materials can be grown overlying monocrystalline substrates (22) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer (24) comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer (28) of silicon oxide. An integrated circuit including at least one surface acoustic wave device can be formed in and over the high quality epitaxial layers.

Abstract: An acoustic wave filter (10) and a method (30) of forming the acoustic wave filter (10) are disclosed. The acoustic wave filter includes a substrate (20) supporting a first die (18) and a second die (18). The first die (18) and second die (18) include either a Surface Acoustic Wave (SAW) resonator or a Bulk Acoustic Wave (BAW) resonator, wherein one of the resonators is configured as a series resonator (12) of the acoustic wave filter (10) and the other resonator is configured as a shunt resonator (14) of the acoustic wave filter (10).

Abstract: A method (100) of providing a time delay to a signal utilizing a surface acoustic wave ladder filter includes a first step (102) of providing a piezoelectric substrate. A second step (104) includes disposing series and shunt coupled surface acoustic wave transducers in a ladder configuration on the substrate with each of the transducers having an associated aperture and an associated number of interdigital electrode elements. A third step (106) includes configuring the associated aperture and an associated number of interdigital electrode elements for each surface acoustic wave transducer for maximum phase linearity of the ladder filter and uniform group delay response from the ladder filter. A fourth step (108) includes adjusting the number of transducers in the ladder filter to provide a desired average group delay. Subsequently passing a signal through the ladder filter will delay the signal by a time equal to the group delay.

Abstract: A piezoelectric substrate (120) and a method for preparing same. The method includes steps of (i) providing a boule of piezoelectric material, (ii) orienting the boule to Euler angles chosen to provide a boundary condition matched to a partially-metallized surface and (iii) sawing the boule into at least a first slice (120) having first and second surfaces, at least one of the first and second surfaces comprising a planar surface. The method desirably but not essentially further includes steps of (iv) polishing at least one of the first and second surfaces to provide a substantially planar polished surface, (v) disposing a layer of metal on the at least one of the first and second surfaces and (vi) patterning the layer of metal to provide at least one interdigitated pattern (105, 110) comprising an acoustic wave transducer (105, 110), the acoustic wave transducer (105, 110) providing the boundary condition matched to a partially-metallized surface.

Abstract: An acoustic wave resonator filter (10) provides series and shunt resonator elements (22, 24) in a ladder network. The series elements (22) are configured in a lowpass configuration. The shunt elements (24) act as impedance inverters in a passband of the filter and they series resonate at an antiresonant frequency of the series elements (22) in a stopband which provides additional isolation. The electrodes (14) of the elements (22, 24) are of a metal thickness which improve the losses of a series resonant frequency in a passband which improves insertion loss. However, any increase in loss near the antiresonant frequency is compensated by the reduced loss near the resonant frequency of the shunt elements (24).

Abstract: A piezoelectric substrate (120) and a method for preparing same. The method includes steps of (i) providing a boule of piezoelectric material, (ii) orienting the boule to Euler angles chosen to provide a boundary condition matched to a partially-metallized surface and (iii) sawing the boule into at least a first slice (120) having first and second surfaces, at least one of the first and second surfaces comprising a planar surface. The method desirably but not essentially further includes steps of (iv) polishing at least one of the first and second surfaces to provide a substantially planar polished surface, (v) disposing a layer of metal on the at least one of the first and second surfaces and (vi) patterning the layer of metal to provide at least one interdigitated pattern (105, 110) comprising an acoustic wave transducer (105, 110), the acoustic wave transducer (105,110) providing the boundary condition matched to a partially-metallized surface.

Abstract: A full duplex radio (10) having improved properties obtained by using surface acoustic wave (SAW) filters (92, 100, 100') having asymmetric frequency responses (76', 76", 140). The filters (92, 100, 100') are composed of series (50.sub.1, 50.sub.1 ') and parallel (50.sub.2, 50.sub.2 ') coupled SAW resonators. Asymmetry is obtained by altering the metallization thickness of either of the series (50.sub.1, 50.sub.1 ') or parallel (50.sub.2, 50.sub.2 ') resonators of each filter (92, 100, 100') to increase or decrease the SAW coupling coefficient of some of the resonators (50.sub.1, 50.sub.1 ', 50.sub.2, 50.sub.2 ') relative to the remainder of the resonators (50.sub.1, 50.sub.1 ', 50.sub.2, 50.sub.2 '). The filters (92, 100, 100') are desirably in pairs arranged with mirror image frequency asymmetry such that the steeper skirts (93, 95) of the frequency responses (76', 76", 140) are adjacent. Greater passband bandwidths (91', 91") can be obtained without adverse affect on transmitter and receiver isolation.

Abstract: A method and apparatus for a ladder filter (300, 400) incorporating same. The filter (100) includes a substrate and a first series resonator (100, 305, 403) disposed on the substrate and electrically coupled in series between the first electrical port (301, 401) and a first node. The first series resonator (100, 305, 403) includes a first series acoustic reflector (303), a first series gap (112), a first series transducer (105, 304, 403), a second series gap (112) and a second series acoustic reflector (115', 306) collectively disposed in an in-line configuration along a principal axis of the substrate. The filter (300, 400) also includes a first shunt resonator (100', 310, 404) disposed on the substrate and electrically coupled in shunt between the first node and ground.

Abstract: An acoustic wave filter (200, 300) having a substrate for supporting propagation of acoustic waves, and first (220, 315), second (235, 330) and third (210, 310) acoustic wave transducers disposed on the substrate. The first acoustic wave transducer (220, 315) includes at least one bus bar (221, 316) electrically coupled to a first electrical port (205, 305) of the acoustic wave filter (200, 300). The second acoustic wave transducer (235, 330) is disposed on the substrate in line with the first acoustic wave transducer (220, 315) and is acoustically coupled thereto. The second acoustic wave transducer (235, 330) includes at least one bus bar (236', 331) electrically coupled to a second electrical port (240, 345) of the acoustic wave filter (200, 300). The third acoustic wave transducer (210, 310) includes at least one bus bar (211, 311') electrically coupled to the first electrical port (205, 305).

Abstract: A method and apparatus for an acoustic wave filter (110) with reduced bulk-wave scattering loss and a ladder filter (30, 40) incorporating same. The method includes steps of providing an acoustic wave propagating substrate (111) and disposing a first reflector (112) on a first surface thereof. The method also includes disposing a first transducer (115) to a first side of the first reflector (112). The first transducer (115) is separated from the first reflector (112) by a first gap (118) having a first width (114) exceeding one-fourth of the acoustic wavelength. The method also includes disposing a second reflector (112') to a side of the first transducer (115) opposite the first reflector (112). The first (112) and second (112') reflectors each include a group of periodically disposed reflective elements (113, 113'). The second reflector (112') is separated from the first transducer (115) by a second gap (140) having a second width (139).

Abstract: An acoustic wave filter with reduced bulk-wave scattering loss has a center frequency and an associated acoustic wavelength. The filter includes a substrate and a first reflector having a first group of periodically disposed reflective elements. The filter includes a first transducer on a first side of the first reflector. The filter also includes a first gap having a first width, located between the first reflector and the first transducer. The first width exceeds one-fourth of the acoustic wavelength. The filter includes a second reflector and a second gap disposed between the first transducer and the second reflector. The second gap has a second breadth exceeding one-fourth of the acoustic wavelength. A first waveguiding element is positioned within the first gap and having a first breadth. The first width exceeds the first breadth.

Abstract: A radio frequency apparatus desirably includes at least one microelectronic device comprising a substrate including the at least one microelectronic device and a package base for mounting the microelectronic device. The package base includes external interconnections coupled to internal interconnections and an adhesive affixing the substrate to the package base. The adhesive is disposed along a first axis of the substrate. The internal interconnections are coupled to the microelectronic device. A lid is sealed to the package base. The lid seals the microelectronic device.

Abstract: A multi-bandwidth SAW filter for an input signal is provided which includes an SAW transducer having a selectable length corresponding to the desired bandwidth of the filter. The SAW filter is responsive to a control signal which corresponds to a selectable bandwidth of the filter to present the input signal to an appropriately lengthed SAW transducer.

Abstract: A filter device comprises an acoustic wave propagating substrate having an effective coupling coefficient k.sup.2 and having a first filter and a second filter disposed on the acoustic wave propagating substrate. The first filter comprises a first electro-acoustic transducer and a first acousto-electric transducer, both disposed on the acoustic wave propagating substrate. The first acousto-electric transducer comprises N.sub.1 many electrode pairs, wherein N.sub.1 .gtoreq.C/k.sup.2. C is a constant having a value in the range from 1 to 2. The first acousto-electric transducer is acoustically coupled to the first electro-acoustic transducer. The second filter comprises a second electro-acoustic transducer and a second acousto-electric transducer, both disposed on the acoustic wave propagating substrate. The second electro-acoustic transducer is electrically coupled to the first acousto-electric transducer. The second electro-acoustic transducer comprises N.sub.2 many electrode pairs, wherein N.sub.2 <C/k.