Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.

Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.

Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.

Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.

Abstract: An x-ray focusing device generally includes a slide pivotable about a pivot point defined at a forward end thereof, a rail unit fixed with respect to the pivotable slide, a forward crystal for focusing x-rays disposed at the forward end of the pivotable slide and a rearward crystal for focusing x-rays movably coupled to the pivotable slide and the fixed rail unit at a distance rearward from the forward crystal. The forward and rearward crystals define reciprocal angles of incidence with respect to the pivot point, wherein pivoting of the slide about the pivot point changes the incidence angles of the forward and rearward crystals while simultaneously changing the distance between the forward and rearward crystals.

Abstract: An x-ray focusing device generally includes a slide pivotable about a pivot point defined at a forward end thereof, a rail unit fixed with respect to the pivotable slide, a forward crystal for focusing x-rays disposed at the forward end of the pivotable slide and a rearward crystal for focusing x-rays movably coupled to the pivotable slide and the fixed rail unit at a distance rearward from the forward crystal. The forward and rearward crystals define reciprocal angles of incidence with respect to the pivot point, wherein pivoting of the slide about the pivot point changes the incidence angles of the forward and rearward crystals while simultaneously changing the distance between the forward and rearward crystals.

Abstract: An X-ray source such as a synchrotron which provides a significant spectral content of hard X-rays is used to expose relatively thick photoresist such that the portions of the photoresist at an exit surface receive at least a threshold dose sufficient to render the photoresist susceptible to a developer, while the entrance surface of the photoresist receives an exposure which does not exceed a power limit at which destructive disruption of the photoresist would occur. The X-ray beam is spectrally shaped to substantially eliminate lower energy photons while allowing a substantial flux of higher energy photons to pass through to the photoresist target. Filters and the substrate of the X-ray mask may be used to spectrally shape the X-ray beam. Machining of photoresists such as polymethylmethacrylate to micron tolerances may be obtained to depths of several centimeters, and multiple targets may be exposed simultaneously.