Patents by Inventor David Peterson

David Peterson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260135067
    Abstract: Embodiments include a plasma processing apparatus including a chamber with an inner chamber wall. A workpiece support is within the inner chamber wall, the workpiece support for supporting a workpiece in a processing region of the chamber. A resonator probe is coupled to the inner chamber wall. The resonator probe includes an exposed resonator and a buried resonator.
    Type: Application
    Filed: November 8, 2024
    Publication date: May 14, 2026
    Inventors: DAVID PETERSON, KELVIN CHAN, SHARIFUL ISLAM BHUIYAN, YUHUA XIAO, RAJESH KUMAR PUTTI, SHUBHAM KIRAN WANI
  • Publication number: 20260081123
    Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.
    Type: Application
    Filed: November 19, 2025
    Publication date: March 19, 2026
    Inventors: DAVID PETERSON, DAVID COUMOU, CHUANG-CHIA LIN, KELVIN CHAN, FARZAD HOUSHMAND, PING-HWA HSIEH, KRISTOPHER FORD
  • Patent number: 12565952
    Abstract: A valve for a fluid line of a vehicle has a fluid channel, a spring element and support element with a sealing element. The support element is movably arranged in the fluid channel, the fluid channel being configured to guide a fluid between a valve opening and a fluid line connected to the valve. The spring element is configured to push a sealing element via the support element on a valve seat to close the valve. The support element is configured to separate the fluid channel from the spring element. Furthermore, a valve coupling assembly has a first fluid line connector and a second fluid line connector. The first fluid line connector comprises the valve.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: March 3, 2026
    Assignee: NORMA GERMANY GMBH
    Inventors: Viktor Stoll, Gary Williams, David Peterson, Daniel Kintea
  • Publication number: 20260024924
    Abstract: This disclosure presents an electrical assembly including an electrical conductor with a planar connection surface and an electrical contact made of an electrically conductive foil with distinct electrical and mechanical characteristics compared to the electrical conductor. The electrical contact is positioned on a specific area of the connection surface and is metallurgically bonded to it. This innovative electrical assembly allows for efficient electrical connections with improved performance and reliability due to the unique properties of the electrically conductive foil and the metallurgical bonding process.
    Type: Application
    Filed: July 18, 2024
    Publication date: January 22, 2026
    Inventors: Nathan Hando, Jonathan Weidner, David Peterson, James Hamilton, William Guthrie, Nicholas Durse
  • Publication number: 20260024944
    Abstract: The present invention discloses a charging connector assembly designed for an electrical energy transfer system. The assembly includes an electrical conductor with a threaded attachment feature and an electrical terminal with a base having a corresponding threaded attachment feature to engage and disengage the conductor's threaded feature directly. The terminal also features a torque feature that can be operated by a tool to rotate the terminal, enhancing installation and removal. The torque feature is conveniently accessible from a user-facing surface of the charging connector assembly when installed, providing ease of removal and replacement of the terminal when needed.
    Type: Application
    Filed: July 18, 2024
    Publication date: January 22, 2026
    Inventors: Nathan Hando, Jonathan Weidner, David Peterson, James Hamilton, William Guthrie, Nicholas Durse
  • Patent number: 12482641
    Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.
    Type: Grant
    Filed: June 9, 2023
    Date of Patent: November 25, 2025
    Assignee: Applied Materials, Inc.
    Inventors: David Peterson, David Coumou, Chuang-Chia Lin, Kelvin Chan, Farzad Houshmand, Ping-Hwa Hsieh, Kristopher Ford
  • Patent number: 12435818
    Abstract: A retainer clip assembly includes a first retainer clip and a second retainer clip that, when attached to the first retainer clip, defines a first aperture and a second aperture with an opening therebetween. The opening between the first and second apertures provides thermal communication between first and second elongate elements, for example an electrical bus bar and a coolant conduit providing a heat sink for the bus bar, when they are secured within the first and second apertures.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: October 7, 2025
    Assignee: Aptiv Technologies AG
    Inventors: Marissa Maury, Wyatt Lipinsky, Andrew Bohan, David Peterson
  • Patent number: 12385583
    Abstract: A valve coupling assembly has a first fluid line connector coupled to a first fluid line and a second fluid line connector coupled to a second fluid line. In an operational state, the first and second fluid line connectors are engaged to each other for fluid communication between the first and second fluid lines. In a disengaged state, the first and second fluid line connectors are disengaged wherein the first and second fluid lines are disconnected. A first valve arranged in the first fluid line connector is configured to control a fluid flow in the first fluid line. In a closed state of the first valve, the first fluid line is sealed, and, in an open state of the first valve, the first fluid line is open. The second fluid line connector comprises at least one push element mounted to a body of the second fluid line connector.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: August 12, 2025
    Assignee: NORMA GERMANY GMBH
    Inventors: Gary Williams, Viktor Stoll, David Peterson, Przemyslaw Lyson, Chris Hands, Daniel Kintea
  • Publication number: 20250239981
    Abstract: Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool. In an embodiment, the method comprises measuring a voltage and a current of a transmission line, converting an analog voltage signal and an analog current signal into a digital voltage signal and a digital current signal, calculating a u-vector from the digital voltage signal and the digital current signal, calculating a C1 position of a first capacitor with real components of the u-vector, and calculating a C2 position of a second capacitor with imaginary components of the u-vector.
    Type: Application
    Filed: April 8, 2025
    Publication date: July 24, 2025
    Inventors: DAVID COUMOU, DAVID PETERSON
  • Publication number: 20250231070
    Abstract: A conduit connection device is described, comprising a housing, which has a connection geometry for connection of a conduit element which is connected to the conduit connection device to a counterpart conduit element, a hollow pipe section for transporting a fluid through the conduit connection device, and a temperature sensor for measuring a temperature of the fluid to be conducted through the conduit connection device. A heat conduction element is arranged in the housing such that the fluid to be transported flows against it on an inner side of the heat conduction element. The temperature sensor is arranged on an outer side of the heat conduction element.
    Type: Application
    Filed: October 19, 2022
    Publication date: July 17, 2025
    Inventors: Brian Thomas IGNACZAK, David PETERSON, Jiri ZUKAL, Viktor STOLL
  • Publication number: 20250218751
    Abstract: Embodiments disclosed herein include an apparatus that comprises a board with a signal generator for generating chirped signals on the board. In an embodiment, a first mixer is on the board and electrically coupled to the signal generator, and a circulator is on the board. In an embodiment, the circulator comprises a first port that is electrically coupled to the mixer, a second port that is electrically coupled to a connector, and a third port. In an embodiment, a second mixer is on the board and electrically coupled to the third port of the circulator. In an embodiment, an analog to digital converter (ADC) is on the board and electrically coupled to the second mixer.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 3, 2025
    Inventors: DAVID PETERSON, DAVID COUMOU
  • Patent number: 12301199
    Abstract: Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool. In an embodiment, the method comprises measuring a voltage and a current of a transmission line, converting an analog voltage signal and an analog current signal into a digital voltage signal and a digital current signal, calculating a u-vector from the digital voltage signal and the digital current signal, calculating a C1 position of a first capacitor with real components of the u-vector, and calculating a C2 position of a second capacitor with imaginary components of the u-vector.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: May 13, 2025
    Assignee: Applied Materials, Inc.
    Inventors: David Coumou, David Peterson
  • Publication number: 20250107624
    Abstract: A recliner mechanism of a recliner to facilitate shipment and final assembly of the recliner mechanism includes a first side linkage, second side linkage, and at least one support member coupling the first and second side linkages. The first and second side linkages each may include a respective seat deck link configured to couple to a seat deck of the recliner and a respective back rest link configured to couple to a back rest of the recliner. The support member extends from a first end pivotally coupled to the first side linkage to a second end pivotally coupled to the second side linkage. The first side linkage is movable relative to the second side linkage from a collapsed configuration to an expanded configuration.
    Type: Application
    Filed: September 30, 2024
    Publication date: April 3, 2025
    Inventors: Brandon Dick, Timothy A Brandtner, Erick Kramer, David Peterson
  • Publication number: 20250080404
    Abstract: Disclosed are systems and methods for a self-contained multi-modal communication system. The multi-modal communication system comprises a first mobile telecommunication node, which provides a private telecommunication network, a layer 2 (L2) backhaul wireless transceiver, an ethernet switch and an embedded edge cloud compute device. The edge cloud compute device includes an automatic failover detection system, wherein the automatic failover detection system receives as input a plurality of network parameters and automatically performs failover and communication modality switching for one or more communication devices associated with the self-contained multi-modal communication system.
    Type: Application
    Filed: November 19, 2024
    Publication date: March 6, 2025
    Applicant: Fenix Group, Inc.
    Inventors: David Peterson, Stefan Schaner, Taylor Thompson, Bryan Coxwell, Aaron Hoogland
  • Patent number: 12216015
    Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: February 4, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Chuang-Chia Lin, David Peterson, Philip Allan Kraus, Amir Bayati
  • Publication number: 20250037973
    Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.
    Type: Application
    Filed: October 10, 2024
    Publication date: January 30, 2025
    Inventors: David Coumou, Zhi Wang, Tao Zhang, David Peterson
  • Patent number: 12192050
    Abstract: Disclosed are systems and methods for a self-contained multi-modal communication system. The multi-modal communication system comprises a first mobile telecommunication node, which provides a private telecommunication network, a layer 2 (L2) backhaul wireless transceiver, an ethernet switch and an embedded edge cloud compute device. The edge cloud compute device includes an automatic failover detection system, wherein the automatic failover detection system receives as input a plurality of network parameters and automatically performs failover and communication modality switching for one or more communication devices associated with the self-contained multi-modal communication system.
    Type: Grant
    Filed: November 27, 2023
    Date of Patent: January 7, 2025
    Assignee: Fenix Group, Inc.
    Inventors: David Peterson, Stefan Schaner, Taylor Thompson, Bryan Coxwell, Aaron Hoogland
  • Publication number: 20240412895
    Abstract: A shielded conductor assembly includes an electrically conductive busbar having a width of the busbar that is greater than a thickness of the busbar and an inner insulative layer surrounding the busbar. The shielded conductor assembly also includes an electrically conductive foil shield layer having a longitudinal seam arranged substantially parallel to a longitudinal axis of the busbar and having a plurality of pleats arranged substantially parallel with one another surrounding the inner insulative layer. The shielded conductor assembly further includes an outer insulative layer surrounding the pleated foil shield layer. The plurality of pleats are configured to allow the busbar to be bent at an angle of at least 90 degrees along the thickness of the busbar without rupturing the foil shield layer. A method of manufacturing such a shielded conductor assembly is also provided.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 12, 2024
    Inventors: Nathan UZARSKI, Robert DEAN, David PETERSON, Joseph SUDIK, JR., Marissa MAURY, Stephen A. VANSUCH
  • Publication number: 20240412959
    Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 12, 2024
    Inventors: David PETERSON, David COUMOU, Chuang-Chia LIN, Kelvin CHAN, Farzad HOUSHMAND, Ping-Hwa HSIEH, Kristopher FORD
  • Publication number: 20240405525
    Abstract: A method of installing an electrical wiring harness in a vehicle, wherein the electrical wiring harness has at least one branch circuit terminated by an electrical connector includes the steps of wrapping the at least one branch circuit around a wire spool configured to be picked up and manipulated by a robotic arm having a gripping mechanism, placing the electrical wiring harness within the vehicle; and grasping the wire spool with the gripping mechanism while simultaneously moving the robotic arm and rotating the wire spool with the gripping mechanism to pay out a desired length of the at least one branch circuit. An apparatus for performing this method and an electrical wiring harness well suited for use with this method is also described herein.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 5, 2024
    Inventors: Nathan UZARSKI, Robert DEAN, Joseph SUDIK, JR., David PETERSON