Abstract: An earcup for headphones with a housing for receiving electroacoustic components and sound-absorbing material, wherein the housing has a housing base body for receiving electroacoustic components and a main shell module for receiving a sound-absorbing material, wherein the main shell module is mechanically connected to the housing base body, wherein a) the housing base body can be added to in a modular manner and a first housing module and a second housing module are provided, wherein the first housing module and the second housing module can each be connected mechanically and electrically to the housing base body alternatively as a different configuration stage and/or b) that the housing has the main shell module for providing different expansion stages, which is b1) is modularly interchangeable and at least one first shell replacement module is provided, which can be mechanically connected to the housing base body as an alternative to the main shell module and/or; b2) is modularly supplementable and at leas