Abstract: In accordance with the invention, a driver circuit is described that permits a single thin gate oxide process to be utilized where a dual oxide process may normally be necessary. Circuits employing only thin gate oxide devices are used as the design basis for a single product with a single set of tooling and manufacturing process to operate within the same timing specifications for a core voltage output drive as well as for a higher system drive.

Abstract: In accordance with the invention, a driver circuit is described that permits a single thin gate oxide process to be utilized where a dual oxide process may normally be necessary. Circuits employing only thin gate oxide devices are used as the design basis for a single product with a single set of tooling and manufacturing process to operate within the same timing specifications for a core voltage output drive as well as for a higher system drive.

Abstract: In accordance with the invention, a driver circuit is described that permits a single thin gate oxide process to be utilized where a dual oxide process may normally be necessary. Circuits employing only thin gate oxide devices are used as the design basis for a single product with a single set of tooling and manufacturing process to operate within the same timing specifications for a core voltage output drive as well as for a higher system drive.

Abstract: In accordance with the invention, a testing circuit formed on the integrated circuit is presented. A testing circuit according to the present invention includes an input circuit coupled to a parameter testing circuit and an output driver coupled to the parameter testing circuit. Embodiments of the parameter testing circuit can include circuits for testing process, device, and circuit characteristics of the integrated circuit. Further, some embodiments of the testing circuit can be included in a scan path system where sequences of various testing circuits are included. Further, test parameters obtained from the parameter testing circuits can be utilized to adjust operating parameters of the integrated circuit.

Abstract: In accordance with the invention, a testing circuit formed on the integrated circuit is presented. A testing circuit according to the present invention is coupled to a scan path circuit and includes an input circuit coupled to a parameter testing circuit and an output driver coupled to the parameter testing circuit. Embodiments of the parameter testing circuit can include circuits for testing process, device, and circuit characteristics of the integrated circuit. Further, some embodiments of the testing circuit can be included in a scan path system where sequences of various testing circuits are included. Further, test parameters obtained from the parameter testing circuits can be utilized to adjust operating parameters of the integrated circuit.

Abstract: An integrated circuit delay device includes a digital delay line configured to provide a percent-of-clock period delay to a timing signal received at an input thereof, in response to a control signal. This control signal has a value that specifies a length of the delay. A delay line control circuit is also provided. The delay line control circuit is configured to generate the control signal by counting multiple cycles of a high frequency oscillator signal (e.g., ring oscillator signal) having a period less than the clock period, over a time interval having a duration greater than the clock period.

Abstract: In accordance with the invention, a driver circuit is described that permits a single thin gate oxide process to be utilized where a dual oxide process may normally be necessary. Circuits employing only thin gate oxide devices are used as the design basis for a single product with a single set of tooling and manufacturing process to operate within the same timing specifications for a core voltage output drive as well as for a higher system drive.

Abstract: Systems and methods of chip design and package implementation for attenuating noise in timing circuits, including phase-locked-loops (PLL) and delay-locked-loops (DLL), are disclosed. Embodiments of the present invention attenuate coupled noise, such as the effects of ground current surges, or power supply noise coupling through electro-static discharge (ESD) structures. In known systems, the ground supplies for the timing circuits are designed with power and ground supplies, separate from the core power and ground; although the ground supplies are connected via common VSSsubstrate, they are separated from pad ring output driver power and ground supplies. In embodiments of the present invention, the PLL or DLL and core supplies are kept separate from the output driver power and ground supplies, providing for improved systems and methods that attenuate the effects of ground current surges from chip output drivers as they switch from logic highs to logic lows.