Patents by Inventor David Potasek

David Potasek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250321174
    Abstract: A MEMS densimeter may include a cantilever portion defining one or more microcapillaries. The microcapillaries may provide an enhanced response to the fluid density. The microcapillaries may include microcapillaries which are aligned with flexure of the cantilever portion, such s through-hole microcapillaries, blind-hole microcapillaries, and grid microcapillaries. The microcapillaries may also include a plate microcapillary aligned normal to the flexure of the cantilever portion.
    Type: Application
    Filed: April 11, 2024
    Publication date: October 16, 2025
    Inventors: David Potasek, Dosi Dosev
  • Publication number: 20250304430
    Abstract: A system for reducing electromotive force (EMF) errors is disclosed. The system may include a circuit component with a plurality of leads soldered to a circuit board. The system may also include a filler material coupled to at least a first lead of the plurality of leads. The system may exhibit an asymmetrical thermal conduction of the first lead relative to a different lead of the plurality of leads due to the filler material.
    Type: Application
    Filed: March 27, 2025
    Publication date: October 2, 2025
    Inventors: David Potasek, Roger Backman
  • Publication number: 20070013014
    Abstract: A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parameter associated with the environment. The sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns. The transducer further includes an output contact located on the substrate and in electrical communication with the sensor means. The transducer includes a package having an internal package space and a port for communication with the environment. The package receives the substrate in the internal package space such that the first surface of the substrate is substantially isolated from the environment and the second surface of the substrate is substantially exposed to the environment through the port.
    Type: Application
    Filed: September 19, 2006
    Publication date: January 18, 2007
    Inventors: Shuwen Guo, Odd Eriksen, David Potasek