Patents by Inventor David POWNEY
David POWNEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11259414Abstract: An apparatus includes a printed circuit board and a flexible printed circuit. A rigid structure component is on a first side of the printed circuit board. An interconnection interface is on a second side of the printed circuit board opposite to the rigid structure component and is configured to interconnect the flexible printed circuit and the printed circuit board. A conductive interconnection material is at the interconnection interface between the flexible printed circuit and the printed circuit board.Type: GrantFiled: December 22, 2017Date of Patent: February 22, 2022Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: David Powney, Ilkka Saarinen, Mikko Kylkilahti, Lei Han
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Patent number: 11224121Abstract: An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.Type: GrantFiled: March 16, 2018Date of Patent: January 11, 2022Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: David Powney, Sami Maattanen
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Patent number: 11025758Abstract: A method for assembling a communication device and the communication device The communication device includes a casing that houses a battery. The battery extends in a main extension plane. The casing includes a back cover to cover the battery, and the back cover extends in a second plane substantially parallel to the main extension plane. The communication device also has an electrical signal transmission line having a first portion and a second portion. The second portion is coupled to a processor of the communication device. The first portion has a longitudinal extension coupled to at least one electrical component, wherein the first portion extends alongside the battery in a third plane substantially perpendicular to the main extension plane.Type: GrantFiled: June 28, 2017Date of Patent: June 1, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Esa Maatta, Jouni Tapio Mäki, David Powney, Mikko Kylkilahti
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Patent number: 11011851Abstract: A multi-antenna system includes an antenna part and a cable part. The antenna part includes comprising antenna lines forming antenna elements. The cable part includes a feeding lines for the antenna elements. Both the antenna part and the cable part are implemented using a flexible printed circuit board. The antenna part includes a single conductor layer area. The cable part includes a three conductor layer area.Type: GrantFiled: May 30, 2017Date of Patent: May 18, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Mikko Kylkilahti, Esa Maatta, David Powney, Ilkka Niemela, Jari Lamminparras, Kyosti Kataja, Jouni Pennanen, Ilkka Saarinen, Guoping Luo, Ismo Manelius
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Publication number: 20210105890Abstract: An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.Type: ApplicationFiled: March 16, 2018Publication date: April 8, 2021Inventors: David Powney, Sami Maattanen
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Patent number: 10972590Abstract: A method for assembling a communication device and the communication device The communication device includes a casing that houses a battery. The battery extends in a main extension plane. The casing includes a back cover to cover the battery, and the back cover extends in a second plane substantially parallel to the main extension plane. The communication device also has an electrical signal transmission line having a first portion and a second portion. The second portion is coupled to a processor of the communication device. The first portion has a longitudinal extension coupled to at least one electrical component, wherein the first portion extends alongside the battery in a third plane substantially perpendicular to the main extension plane.Type: GrantFiled: June 28, 2017Date of Patent: April 6, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Esa Maatta, Jouni Tapio Mäki, David Powney, Mikko Kylkilahti
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Patent number: 10965037Abstract: A multi-antenna system includes an antenna part and a cable part. The antenna part includes comprising antenna lines forming antenna elements. The cable part includes a feeding lines for the antenna elements. Both the antenna part and the cable part are implemented using a flexible printed circuit board. The antenna part includes a single conductor layer area. The cable part includes a three conductor layer area.Type: GrantFiled: May 30, 2017Date of Patent: March 30, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Mikko Kylkilahti, Esa Maatta, David Powney, Ilkka Niemela, Jari Lamminparras, Kyosti Kataja, Jouni Pennanen, Ilkka Saarinen, Guoping Luo, Ismo Manelius
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Publication number: 20200389982Abstract: An apparatus includes a printed circuit board and a flexible printed circuit. A rigid structure component is on a first side of the printed circuit board. An interconnection interface is on a second side of the printed circuit board opposite to the rigid structure component and is configured to interconnect the flexible printed circuit and the printed circuit board. A conductive interconnection material is at the interconnection interface between the flexible printed circuit and the printed circuit board.Type: ApplicationFiled: December 22, 2017Publication date: December 10, 2020Inventors: David POWNEY, Ilkka SAARINEN, Mikko KYLKILAHTI, Lei HAN
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Publication number: 20200374378Abstract: A method for assembling a communication device and the communication device The communication device includes a casing that houses a battery. The battery extends in a main extension plane. The casing includes a back cover to cover the battery, and the back cover extends in a second plane substantially parallel to the main extension plane. The communication device also has an electrical signal transmission line having a first portion and a second portion. The second portion is coupled to a processor of the communication device. The first portion has a longitudinal extension coupled to at least one electrical component, wherein the first portion extends alongside the battery in a third plane substantially perpendicular to the main extension plane.Type: ApplicationFiled: June 28, 2017Publication date: November 26, 2020Inventors: Esa Maatta, Jouni Tapio Mäki, David Powney, Mikko Kylkilahti
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Publication number: 20200119452Abstract: A multi-antenna system includes an antenna part and a cable part. The antenna part includes comprising antenna lines forming antenna elements. The cable part includes a feeding lines for the antenna elements. Both the antenna part and the cable part are implemented using a flexible printed circuit board. The antenna part includes a single conductor layer area. The cable part includes a three conductor layer area.Type: ApplicationFiled: May 30, 2017Publication date: April 16, 2020Inventors: Mikko KYLKILAHTI, Esa MAATTA, David POWNEY, Ilkka NIEMELA, Jari LAMMINPARRAS, Kyosti KATAJA, Jouni PENNANEN, Ilkka SAARINEN, Guoping LUO, Ismo MANELIUS
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Publication number: 20200083594Abstract: An antenna assembly including a support and at least one conductive layer on the support having an antenna radiator patterned therein. The antenna assembly further includes a first conductive pad on the support, and the first conductive pad is electrically coupled to the antenna radiator. Additionally, the antenna assembly includes a radio frequency (RF) transmission line structure attached to the support, and the RF transmission line structure includes a signal line for transmitting an RF signal to or from the antenna radiator, the signal line being capacitively coupled to the first conductive pad.Type: ApplicationFiled: May 23, 2017Publication date: March 12, 2020Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Esa MAATTA, Jouni PENNANEN, Ilkka NIEMELA, Ilkka SAARINEN, Ismo MANELIUS, David POWNEY, Guoping LUO, Jari LAMMINPARRAS, Mikko KYLKILAHTI, Kyosti KATAJA