Patents by Inventor David Prchal

David Prchal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240031748
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Application
    Filed: August 8, 2023
    Publication date: January 25, 2024
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Patent number: 11765531
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: September 19, 2023
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Publication number: 20220007119
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Application
    Filed: July 12, 2021
    Publication date: January 6, 2022
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Patent number: 11064304
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: July 13, 2021
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Publication number: 20200154219
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Application
    Filed: October 11, 2019
    Publication date: May 14, 2020
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Patent number: 10448176
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: October 15, 2019
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Publication number: 20180352347
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Application
    Filed: August 8, 2018
    Publication date: December 6, 2018
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Patent number: 10051390
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: August 14, 2018
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Patent number: 9913052
    Abstract: Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: March 6, 2018
    Assignee: Starkey Laboratories, Inc.
    Inventors: John Dzarnoski, Susie Krzmarzick, Douglas F. Link, David Prchal
  • Patent number: 9906879
    Abstract: Disclosed herein, among other things, are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. According to various embodiments, the method includes providing a structure including a laser-direct structuring (LDS) portion, and inserting a flexible universal circuit module (UCM) having conductive surface traces into the structure. The UCM is electrically connected to the LDS portion using direct compression without the use of wires or solder, according to various embodiments.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: February 27, 2018
    Assignee: Starkey Laboratories, Inc.
    Inventors: David Prchal, Susie Johansson, John Dzarnoski
  • Publication number: 20170318402
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Application
    Filed: May 15, 2017
    Publication date: November 2, 2017
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Patent number: 9654887
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: May 16, 2017
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Publication number: 20150230035
    Abstract: Disclosed herein, among other things, are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. According to various embodiments, the method includes providing a structure including a laser-direct structuring (LDS) portion, and inserting a flexible universal circuit module (UCM) having conductive surface traces into the structure. The UCM is electrically connected to the LDS portion using direct compression without the use of wires or solder, according to various embodiments.
    Type: Application
    Filed: April 22, 2015
    Publication date: August 13, 2015
    Inventors: David Prchal, Susie Johansson, John Dzarnoski
  • Publication number: 20150146899
    Abstract: Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.
    Type: Application
    Filed: November 27, 2013
    Publication date: May 28, 2015
    Applicant: Starkey Laboratories, Inc.
    Inventors: John Dzarnoski, Susie Krzmarzick, Douglas F. Link, David Prchal
  • Publication number: 20150086051
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Application
    Filed: April 21, 2014
    Publication date: March 26, 2015
    Applicant: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Publication number: 20150071470
    Abstract: Disclosed herein, among other things, are systems and methods for improved circuit design for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device configured to compensate for hearing losses of a user. The hearing assistance device includes a flexible circuit substrate and an integrated circuit die embedded within the flexible circuit substrate. The integrated circuit die includes a digital signal processor (DSP) die, in an embodiment. In various embodiments, the DSP die includes a DSP configured to provide processing for the hearing assistance device.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 12, 2015
    Applicant: Starkey Laboratories, Inc.
    Inventors: Douglas F Link, Ay Vang, John Dzarnoski, Andy Lambert, Dale Splettstoeszer, Susie Krzmarzick, David Prchal, Kexia Sun, Yangjun Xing
  • Patent number: 8705785
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: April 22, 2014
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Publication number: 20100034410
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Application
    Filed: August 11, 2009
    Publication date: February 11, 2010
    Applicant: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins