Patents by Inventor David Pursalan

David Pursalan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phase change material electronic memory structure and method for forming
    Patent number: 6605821
    Abstract: The invention includes an electronic memory structure. The electronic memory structure includes a substrate. A substantially planar first conductor is formed adjacent to the substrate. An interconnection layer is formed adjacent to the first conductor. A phase change material element is formed adjacent to the interconnection layer. The interconnection layer includes a conductive interconnect structure extending from the first conductor to the phase change material element. The interconnect structure includes a first surface physically connected to the first conductor. The interconnect structure further includes a second surface attached to the phase change material element. The second surface area of the second surface is substantially smaller than a first surface area of the first surface. A substantially planar second conductor is formed adjacent to the phase change material element.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: August 12, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Heon Lee, Dennis Lazaroff, Neal Meyer, Jim Ellenson, Ken Kramer, Kurt Ulmer, David Pursalan, Peter Fricke, Andrew Koll, Andy Van Brockin