Abstract: A particulate matter (PM) sensor comprises a substrate forming a cavity (5), the substrate comprising a semiconductor chip (4), and a light source (1) arranged in the cavity (5). The light source (1) is adapted to emit a light beam (7). The light beam (7) forms a detection volume (8) for particulate matter (9) outside the cavity (5). Optionally, the particulate matter sensor comprises an optical element (2) delimiting the cavity (5) at one end. The optical element (2) is configured to shape the light beam (7). Further, the particulate matter sensor comprises at least one photodetector (3) that is integrated into a surface of the semiconductor chip (4). The surface into which the at least one photodetector (3) is integrated faces the detection volume (8). The at least one photodetector (3) is adapted to detect light (10) scattered by particulate matter (9) in the detection volume (8).

Abstract: A particulate matter (PM) sensor comprises a substrate forming a cavity (5), the substrate comprising a semiconductor chip (4), and a light source (1) arranged in the cavity (5). The light source (1) is adapted to emit a light beam (7). The light beam (7) forms a detection volume (8) for particulate matter (9) outside the cavity (5). Optionally, the particulate matter sensor comprises an optical element (2) delimiting the cavity (5) at one end. The optical element (2) is configured to shape the light beam (7). Further, the particulate matter sensor comprises at least one photodetector (3) that is integrated into a surface of the semiconductor chip (4). The surface into which the at least one photodetector (3) is integrated faces the detection volume (8). The at least one photodetector (3) is adapted to detect light (10) scattered by particulate matter (9) in the detection volume (8).

Abstract: A photoacoustic gas sensor device for deter-mining a value indicative of a presence or a concentration of a component in a gas comprises a substrate and a measurement cell body, the substrate and the measurement cell body defining a measurement cell enclosing a measurement volume. A reflective shield divides the measurement volume into a first volume and a second volume. An opening in the measurement cell is provided for a gas to enter the measurement volume. In the first volume and on a front side of the substrate are arranged: An electromagnetic radiation source for emitting electromagnetic radiation through an aperture in the reflective shield into the second volume; and a pressure transducer communicatively coupled to the second volume for measuring a sound wave generated by the component in response to an absorption of electromagnetic radiation by the component. At least a portion of a surface of the reflective shield facing the second volume is made of a material reflecting electromagnetic radiation.

Abstract: A sensor package comprises a sensor chip (3) with a sensitive element (31) exposed to an environment of the sensor package, and contact pads (2) for electrically contacting the sensor package. Electrical connections (5) are applied between the sensor chip (3) and the contact pads (2). A molding compound (1) at least partially encloses the sensor chip (3) and the contact pads (2). A unit (3, 73) consisting of the sensor chip (3) and optionally of a die pad (73) supporting the sensor chip (3) is arranged such that a top surface (ts) of the unit (3, 73) does not protrude from a level defined by a top surface (ts) of the contact pads (2), and a bottom surface (bs) of the unit (3,73) does not protrude from a level defined by a bottom surface (bs) of the contact pads (2).

Abstract: A sensor package comprises a sensor chip (3) with a sensitive element (31) exposed to an environment of the sensor package, and contact pads (2) for electrically contacting the sensor package. Electrical connections (5) are applied between the sensor chip (3) and the contact pads (2). A molding compound (1) at least partially encloses the sensor chip (3) and the contact pads (2). A unit (3,73) consisting of the sensor chip (3) and optionally of a die pad (73) supporting the sensor chip (3) is arranged such that a top surface (ts) of the unit (3,73) does not protrude from a level defined by a top surface (ts) of the contact pads (2), and a bottom surface (bs) of the unit (3,73) does not protrude from a level defined by a bottom surface (bs) of the contact pads (2).

Abstract: The invention relates to a sensor device (1) which comprises a circuit board (50) and at least one sensor (52) arranged on the circuit board (50). Further, the sensor device (1) comprises a housing (20) wherein the housing (20) comprises at least a first opening (30). The circuit board (50) comprises a marking (40), wherein the marking (40) codes information, and wherein the at least one first opening (30) is configured and arranged such that it leaves the marking (40) uncovered by the housing (20) such that the marking (40) is visible from outside of the housing (20) through the at least one first opening (30).

Abstract: A gas sensor package comprises a gas sensor chip with a layer sensitive to a gas, and with a heater for heating the sensitive layer. Contact pads are provided for electrically contacting the gas sensor package and a die pad is provided for mounting the gas sensor chip to. Electrical connections connect the gas sensor chip and the contact pads. A molding compound at least partially encloses the gas sensor chip. An opening in the molding compound provides access to the sensitive layer of the gas sensor chip. One of the contact pads serves as a pin for supplying electrical current to the heater of the gas sensor chip.

Abstract: A sensor package comprises a carrier comprising a through hole, and a sensor chip with a front side and a back side and a recess in the back side. The sensor chip is attached to the carrier with its back side facing the carrier by means of an attachment layer thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess. The through hole is arranged in the first area of the carrier.

Abstract: A sensor package comprises a carrier comprising a through hole, and a sensor chip with a front side and a back side and a recess in the back side. The sensor chip is attached to the carrier with its back side facing the carrier by means of an attachment layer thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess. The through hole is arranged in the first area of the carrier.

Abstract: A gas sensor package comprises a gas sensor chip with a layer sensitive to a gas, and with a heater for heating the sensitive layer. Contact pads are provided for electrically contacting the gas sensor package and a die pad is provided for mounting the gas sensor chip to. Electrical connections connect the gas sensor chip and the contact pads. A molding compound at least partially encloses the gas sensor chip. An opening in the molding compound provides access to the sensitive layer of the gas sensor chip. One of the contact pads serves as a pin for supplying electrical current to the heater of the gas sensor chip.