Patents by Inventor David Quach

David Quach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240301028
    Abstract: Polypeptides comprising: (i) an MHC class I ? polypeptide association domain, (ii) a transmembrane domain, and (iii) a signalling domain comprising an ITAM-containing sequence are disclosed. Also disclosed are nucleic acids and expression vectors encoding, compositions comprising, and methods using such polypeptides.
    Type: Application
    Filed: April 24, 2024
    Publication date: September 12, 2024
    Applicant: Baylor College of Medicine
    Inventors: David Quach, Cliona M. Rooney
  • Publication number: 20230293780
    Abstract: The field of materials and manufacturing methods involving single or multi-solvent, excipient and polymer-free drug coating formulations for production of microsphere coated drug delivery techniques.
    Type: Application
    Filed: July 28, 2021
    Publication date: September 21, 2023
    Inventors: Ronald E. Betts, Ana Jhelynne P. Nagui, John Dang Nguyen, David Quach
  • Publication number: 20210238255
    Abstract: Polypeptides comprising: (i) an MHC class I ? polypeptide association domain, (ii) a transmembrane domain, and (iii) a signalling domain comprising an ITAM-containing sequence are disclosed. Also disclosed are nucleic acids and expression vectors encoding, compositions comprising, and methods using such polypeptides.
    Type: Application
    Filed: April 18, 2019
    Publication date: August 5, 2021
    Applicant: Baylor College of Medicine
    Inventors: David Quach, Cliona M. Rooney
  • Patent number: 7460972
    Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.
    Type: Grant
    Filed: March 21, 2007
    Date of Patent: December 2, 2008
    Assignee: Sokudo Co., Ltd.
    Inventors: Sharathchandra Somayaji, Christopher L. Beaudry, David Quach
  • Patent number: 7431585
    Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: October 7, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Jun Zhao, David Quach, Timothy Weidman, Rick J. Roberts, Farhad Moghadam, Dan Maydan
  • Patent number: 7381052
    Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: June 3, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Jun Zhao, David Quach, Timothy Weidman, Rick J. Roberts, Farhad Moghadam, Dan Maydan
  • Publication number: 20080097714
    Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.
    Type: Application
    Filed: March 21, 2007
    Publication date: April 24, 2008
    Applicant: SOKUDO CO., LTD.
    Inventors: Sharathchandra Somayaji, Christopher L. Beaudry, David Quach
  • Publication number: 20080047950
    Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
    Type: Application
    Filed: October 30, 2007
    Publication date: February 28, 2008
    Applicant: Sokudo Co., Ltd.
    Inventors: David Quach, Martin Salinas
  • Publication number: 20080023656
    Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
    Type: Application
    Filed: October 5, 2007
    Publication date: January 31, 2008
    Applicant: Sokudo Co., Ltd.
    Inventors: David Quach, Martin Salinas
  • Publication number: 20070295276
    Abstract: A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.
    Type: Application
    Filed: September 4, 2007
    Publication date: December 27, 2007
    Applicant: SOKUDO CO., LTD.
    Inventors: David Quach, Tetsuya Ishikawa
  • Publication number: 20060286300
    Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.
    Type: Application
    Filed: July 19, 2006
    Publication date: December 21, 2006
    Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue, John Backer
  • Publication number: 20060278165
    Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.
    Type: Application
    Filed: July 19, 2006
    Publication date: December 14, 2006
    Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, John Backer, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
  • Publication number: 20060237433
    Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
    Type: Application
    Filed: July 5, 2005
    Publication date: October 26, 2006
    Applicant: Applied Materials, Inc.,
    Inventors: David Quach, Martin Salinas
  • Publication number: 20060237430
    Abstract: A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.
    Type: Application
    Filed: July 5, 2005
    Publication date: October 26, 2006
    Applicant: Applied Materials, Inc.
    Inventors: David Quach, Tetsuya Ishikawa
  • Publication number: 20060237432
    Abstract: An integrated thermal unit comprising a bake plate having a substrate holding surface configured to hold and heat a substrate in a baking position and a chill plate having a substrate holding surface configured to hold and cool a substrate in a cooling position where the substrate holding surface of the bake plate is positioned in a first substantially horizontal plane when the bake plate is in the baking position and the substrate holding surface of the chill plate is positioned in a second substantially horizontal plane that is below the first plane when the chill plate is in a cooling position.
    Type: Application
    Filed: July 5, 2005
    Publication date: October 26, 2006
    Applicant: Applied Materials, Inc.
    Inventors: David Quach, Tetsuya Ishikawa
  • Publication number: 20060237431
    Abstract: An integrated thermal unit comprises a bake station comprising a bake plate configured to hold and heat a substrate; a chill station comprising a chill plate configured to hold and cool a substrate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the chill plate along a horizontally linear path within the thermal unit and raise and lower substrates along a vertical path within the integrated thermal unit.
    Type: Application
    Filed: July 5, 2005
    Publication date: October 26, 2006
    Applicant: Applied Materials, Inc.
    Inventors: David Quach, Martin Salinas
  • Publication number: 20060223233
    Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.
    Type: Application
    Filed: June 2, 2006
    Publication date: October 5, 2006
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Jun Zhao, David Quach, Timothy Weidman, Rick Roberts, Farhad Moghadam, Dan Maydan
  • Publication number: 20060130750
    Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.
    Type: Application
    Filed: April 22, 2005
    Publication date: June 22, 2006
    Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Mike Rice, David Quach, Mohsen Salek, Robert Lowrance, John Backer, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
  • Publication number: 20060134330
    Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.
    Type: Application
    Filed: April 22, 2005
    Publication date: June 22, 2006
    Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue, John Backer
  • Publication number: 20050229849
    Abstract: Embodiments of the present invention are generally directed to apparatus and methods for a plasma-processing chamber requiring less maintenance and downtime and possessing improved reliability over the prior art. In one embodiment, the apparatus includes a substrate support resting on a ceramic shaft, an inner shaft allowing for electrical connections to the substrate support at atmospheric pressure, an aluminum substrate support resting on but not fixed to a ceramic support structure, sapphire rest points swaged into the substrate support, and a heating element inside the substrate support arranged in an Archimedes spiral to reduce warping of the substrate support and to increase its lifetime. Methods include increasing time between in-situ cleans of the chamber by reducing particle generation from chamber surfaces. Reduced particle generation occurs via temperature control of chamber components and pressurization of non-processing regions of the chamber relative to the processing region with a purge gas.
    Type: Application
    Filed: February 11, 2005
    Publication date: October 20, 2005
    Inventors: Mario Silvetti, David Quach, Bok Kim, Thomas Nowak, Thomas Cho, Fred Hariz, Robert Moore