Patents by Inventor David Quach
David Quach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240301028Abstract: Polypeptides comprising: (i) an MHC class I ? polypeptide association domain, (ii) a transmembrane domain, and (iii) a signalling domain comprising an ITAM-containing sequence are disclosed. Also disclosed are nucleic acids and expression vectors encoding, compositions comprising, and methods using such polypeptides.Type: ApplicationFiled: April 24, 2024Publication date: September 12, 2024Applicant: Baylor College of MedicineInventors: David Quach, Cliona M. Rooney
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Publication number: 20230293780Abstract: The field of materials and manufacturing methods involving single or multi-solvent, excipient and polymer-free drug coating formulations for production of microsphere coated drug delivery techniques.Type: ApplicationFiled: July 28, 2021Publication date: September 21, 2023Inventors: Ronald E. Betts, Ana Jhelynne P. Nagui, John Dang Nguyen, David Quach
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Publication number: 20210238255Abstract: Polypeptides comprising: (i) an MHC class I ? polypeptide association domain, (ii) a transmembrane domain, and (iii) a signalling domain comprising an ITAM-containing sequence are disclosed. Also disclosed are nucleic acids and expression vectors encoding, compositions comprising, and methods using such polypeptides.Type: ApplicationFiled: April 18, 2019Publication date: August 5, 2021Applicant: Baylor College of MedicineInventors: David Quach, Cliona M. Rooney
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Patent number: 7460972Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.Type: GrantFiled: March 21, 2007Date of Patent: December 2, 2008Assignee: Sokudo Co., Ltd.Inventors: Sharathchandra Somayaji, Christopher L. Beaudry, David Quach
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Patent number: 7431585Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.Type: GrantFiled: October 22, 2002Date of Patent: October 7, 2008Assignee: Applied Materials, Inc.Inventors: Jun Zhao, David Quach, Timothy Weidman, Rick J. Roberts, Farhad Moghadam, Dan Maydan
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Patent number: 7381052Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.Type: GrantFiled: June 2, 2006Date of Patent: June 3, 2008Assignee: Applied Materials, Inc.Inventors: Jun Zhao, David Quach, Timothy Weidman, Rick J. Roberts, Farhad Moghadam, Dan Maydan
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Publication number: 20080097714Abstract: A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.Type: ApplicationFiled: March 21, 2007Publication date: April 24, 2008Applicant: SOKUDO CO., LTD.Inventors: Sharathchandra Somayaji, Christopher L. Beaudry, David Quach
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Publication number: 20080047950Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: Sokudo Co., Ltd.Inventors: David Quach, Martin Salinas
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Publication number: 20080023656Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.Type: ApplicationFiled: October 5, 2007Publication date: January 31, 2008Applicant: Sokudo Co., Ltd.Inventors: David Quach, Martin Salinas
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Publication number: 20070295276Abstract: A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.Type: ApplicationFiled: September 4, 2007Publication date: December 27, 2007Applicant: SOKUDO CO., LTD.Inventors: David Quach, Tetsuya Ishikawa
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Publication number: 20060286300Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: July 19, 2006Publication date: December 21, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue, John Backer
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Publication number: 20060278165Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: July 19, 2006Publication date: December 14, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, John Backer, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20060237433Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.Type: ApplicationFiled: July 5, 2005Publication date: October 26, 2006Applicant: Applied Materials, Inc.,Inventors: David Quach, Martin Salinas
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Publication number: 20060237430Abstract: A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.Type: ApplicationFiled: July 5, 2005Publication date: October 26, 2006Applicant: Applied Materials, Inc.Inventors: David Quach, Tetsuya Ishikawa
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Publication number: 20060237432Abstract: An integrated thermal unit comprising a bake plate having a substrate holding surface configured to hold and heat a substrate in a baking position and a chill plate having a substrate holding surface configured to hold and cool a substrate in a cooling position where the substrate holding surface of the bake plate is positioned in a first substantially horizontal plane when the bake plate is in the baking position and the substrate holding surface of the chill plate is positioned in a second substantially horizontal plane that is below the first plane when the chill plate is in a cooling position.Type: ApplicationFiled: July 5, 2005Publication date: October 26, 2006Applicant: Applied Materials, Inc.Inventors: David Quach, Tetsuya Ishikawa
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Publication number: 20060237431Abstract: An integrated thermal unit comprises a bake station comprising a bake plate configured to hold and heat a substrate; a chill station comprising a chill plate configured to hold and cool a substrate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the chill plate along a horizontally linear path within the thermal unit and raise and lower substrates along a vertical path within the integrated thermal unit.Type: ApplicationFiled: July 5, 2005Publication date: October 26, 2006Applicant: Applied Materials, Inc.Inventors: David Quach, Martin Salinas
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Publication number: 20060223233Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.Type: ApplicationFiled: June 2, 2006Publication date: October 5, 2006Applicant: APPLIED MATERIALS, INC.Inventors: Jun Zhao, David Quach, Timothy Weidman, Rick Roberts, Farhad Moghadam, Dan Maydan
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Publication number: 20060130750Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: April 22, 2005Publication date: June 22, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Mike Rice, David Quach, Mohsen Salek, Robert Lowrance, John Backer, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20060134330Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: April 22, 2005Publication date: June 22, 2006Inventors: Tetsuya Ishikawa, Rick Roberts, Helen Armer, Leon Volfovski, Jay Pinson, Michael Rice, David Quach, Mohsen Salek, Robert Lowrance, William Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue, John Backer
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Publication number: 20050229849Abstract: Embodiments of the present invention are generally directed to apparatus and methods for a plasma-processing chamber requiring less maintenance and downtime and possessing improved reliability over the prior art. In one embodiment, the apparatus includes a substrate support resting on a ceramic shaft, an inner shaft allowing for electrical connections to the substrate support at atmospheric pressure, an aluminum substrate support resting on but not fixed to a ceramic support structure, sapphire rest points swaged into the substrate support, and a heating element inside the substrate support arranged in an Archimedes spiral to reduce warping of the substrate support and to increase its lifetime. Methods include increasing time between in-situ cleans of the chamber by reducing particle generation from chamber surfaces. Reduced particle generation occurs via temperature control of chamber components and pressurization of non-processing regions of the chamber relative to the processing region with a purge gas.Type: ApplicationFiled: February 11, 2005Publication date: October 20, 2005Inventors: Mario Silvetti, David Quach, Bok Kim, Thomas Nowak, Thomas Cho, Fred Hariz, Robert Moore