Patents by Inventor David R. Arnett

David R. Arnett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for etching a conductive layer to improve yield
    Patent number: 5849641
    Abstract: A method in a substrate processing chamber for forming a conductive feature by etching through a conductive layer disposed above a semiconductor substrate. The method includes etching at least partially through the conductive layer using a first etch recipe to form a top portion of the conductive feature. The method further includes thereafter etching at least partially through a remaining thickness of the conductive layer using a second etch recipe different from the first etch recipe to form a bottom portion of the conductive feature. The bottom portion is disposed below the top portion. The second etch recipe is configured to yield a sloped etch foot in the bottom portion of the conductive feature.
    Type: Grant
    Filed: March 19, 1997
    Date of Patent: December 15, 1998
    Assignee: Lam Research Corporation
    Inventors: David R. Arnett, Jeffrey V. Musser