Patents by Inventor David R. Bach

David R. Bach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual interposer packaging for high density interconnect
    Patent number: 6812485
    Abstract: A method and apparatus that allows additional contact pads to be added to a package to support debug and test operations is disclosed. In a preferred embodiment, a circuit board apparatus includes a semiconductor package and an interposer for receiving the semiconductor package. The semiconductor package preferably includes a substrate having a matrix of conductive contact pads on both the top and bottom surfaces of the substrate. The interposer preferably includes a body having a matrix of interposer contact bumps on both the inner and outer surfaces of the body. Each interposer contact bump preferably includes a metal coating and is shaped to abut a contact pad of the semiconductor package.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: November 2, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sharad M. Shah, David R. Bach, Angelo Villani, Nicholas Palmer
  • Dual interposer packaging for high density interconnect
    Publication number: 20030123231
    Abstract: A method and apparatus that allows additional contact pads to be added to a package to support debug and test operations is disclosed. In a preferred embodiment, a circuit board apparatus includes a semiconductor package and an interposer for receiving the semiconductor package. The semiconductor package preferably includes a substrate having a matrix of conductive contact pads on both the top and bottom surfaces of the substrate. The interposer preferably includes a body having a matrix of interposer contact bumps on both the inner and outer surfaces of the body. Each interposer contact bump preferably includes a metal coating and is shaped to abut a contact pad of the semiconductor package.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 3, 2003
    Inventors: Sharad M. Shah, David R. Bach, Angelo Villani, Nicholas Palmer