Patents by Inventor David R. Backen

David R. Backen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layers with vias in filled holes
    Publication number: 20030113510
    Abstract: Multi-layers having at least one plated and filled via or through hole in which a portion of the material filling the via or through hole is removed to allow the spaced previously occupied by the removed material to be used for some other purpose. In some multi-layers, the removed material will be replaced by a second plated via or through hole thus providing additional interconnect options or to functioning as a part of a larger component.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 19, 2003
    Inventors: Mark S. Lopac, David R. Backen, Kevin C. Dane, Steve H. Schultz