Abstract: An electrical interconnect comprising a non-conductive substrate having respective opposite surfaces and a plurality of apertures formed therein extending between the respective opposite surfaces, and a corresponding plurality of elastic conductive interconnect elements located within the plurality of apertures, in which each elastic conductive interconnect element extends between the respective opposite surfaces of the substrate. Each elastic conductive interconnect element is formed of a non-conductive elastic material having a quantity of conductive flakes and a quantity of conductive powder granules interspersed therein. The interconnect elements can be integrally molded in the substrate or separately formed and inserted in the substrate.

Abstract: An electrically conductive elastomer for grafting to thermoplastic and thermoset substrates is disclosed. If the substrate is a thermoset substrate, the electrically conductive elastomer comprises a mixture of an elastic material, a quantity of electrically conductive flakes, a thermoplastic elastomer material, and a thermoset material. If the substrate is a thermoplastic substrate, the electrically conductive elastomer comprises a mixture of an elastic material, a quantity of electrically conductive flakes, a thermoplastic elastomer material, and a thermoplastic material. The electrically conductive elastomer may further comprise a quantity of electrically conductive particles interspersed within the mixture. Alternatively, a quantity of electrically conductive particles may be imbedded in an outer surface of the electrically conductive elastomer. The electrically conductive elastomer is typically grafted to the substrate by a thermal process.

Abstract: An electrically conductive elastomer for grafting to an elastic substrate is disclosed. The conductive elastomer comprises a non-conductive elastic material having a quantity of conductive flakes interspersed therein. The conductive elastomer may further comprise a quantity of conductive particles interspersed in the non-conductive elastic material. Alternatively, a quantity of conductive particles may be imbedded in an outer surface of the conductive elastomer. The conductive elastomer is typically grafted to an elastic substrate by a thermal process.

Abstract: A board-to-board interconnect socket (40) provides electrical interconnection between printed circuit boards (50, 52). Resilient metalized particle interconnects (28) are disposed in holes in a rigid substrate (14) of desired thickness. Each resilient interconnect (28) includes first and second cap members (18, 20) that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members (18, 20) may be connected with a stem member (22) or conductive paste (34) that is disposed inside the hole. The hole may be lined with conductive material (26) such as conductive plating to facilitate conduction of electricity.

Abstract: Several different types of electrical switches are disclosed. In one particular embodiment, an electrical switch is disclosed comprising: a molded case having a pair of conductive terminal contacts; and a molded actuator for mating with the case. The actuator is movable between a conducting position and a non-conducting position within the case, and the actuator has at least one spring member and a conductive contact surface. The spring member forces the actuator into the non-conducting position, and the conductive contact surface provides an electrical connection between the pair of conductive terminal contacts when the actuator is in the conducting position. The actuator is retained within the case by a retaining member and/or a snap member. The case and the actuator are molded about the conductive terminal contacts and the spring members, respectively. Furthermore, the conductive contact surface is formed of a conductive elastomer that is grafted to the actuator.

Abstract: An electrically conductive elastomer for grafting to a metal substrate is disclosed. The electrically conductive elastomer includes a mixture of an elastic material, a quantity of electrically conductive flakes, a thermoplastic elastomer material, a conductive thermoplastic polymer material, and a noble metal or noble metal composite material. The electrically conductive elastomer may further include a quantity of electrically conductive particles interspersed within the mixture. Alternatively, a quantity of electrically conductive particles may be imbedded in an outer surface of the electrically conductive elastomer. The electrically conductive elastomer is typically grafted to the substrate by a thermal process.

Abstract: Several different types of electrically conductive elastomers are disclosed along with the methods for their fabrication. In one particular embodiment, a layered composition is disclosed which comprises a substrate, a first layer, and a second layer. The substrate is formed of a non-conductive elastic material and it has an outer surface. The first layer, which is formed with a non-conductive elastic material, is grafted to the outer surface of the substrate. The second layer, which is formed with a non-conductive elastic material having a quantity of conductive flakes interspersed therein, is grafted to an outer surface of the first layer. The second layer can further be formed with a quantity of rounded or jagged conductive particles interspersed in the non-conductive elastic material such that some of the conductive particles are present along an outer surface of the second layer. Alternatively, a quantity of rounded or jagged conductive particles may be imbedded in an outer surface of the second layer.

Abstract: A dust sensing apparatus uses a transducer element oscillating at a resonant frequency to detect changes in dust concentration. The transducer is fabricated from a polymer material which oscillates when a voltage is applied. The presence of dust affects the oscillation frequency. Dampening of the frequency by the dust presence changes the electrical resistance provided by the transducer. Electronic circuitry computes the level of dust by measuring and controlling the level of the AC signal required to maintain the oscillation frequency by monitoring the resistance.

Abstract: A thermoplastic elastomer barrier layer is disclosed. The thermoplastic elastomer barrier layer may be grafted to a substrate for preventing contaminants from permeating through the substrate or for preventing contaminants, which may permeate through the substrate, from permeating beyond the substrate. The thermoplastic elastomer barrier layer is grafted to the substrate by a thermal grafting process.

Abstract: A reusable socket adapted for use in making an electrical connection between an integrated circuit of a ball grid array (BGA) type package and a circuit board or test fixture. In one embodiment, the socket includes a return member for reshaping the socket. In a further embodiment, a socket assembly includes a plurality of spaced sockets. In an alternative embodiment, a socket assembly further includes a base member. In another embodiment, a socket is formed from a temperature dependent smart memory material. In a further embodiment, a socket assembly includes a plurality of sockets formed from a shape memory material. In an alternative embodiment, a zero insertion force (ZIF) or a low insertion force (LIF) socket assembly for a BGA package includes a plurality of sockets and a lever adapted for frictionally engaging respective BGA contact balls.

Abstract: An electrical interconnect is provided for connecting an integrated circuit or other electrical or electronic component to a circuit board or for interconnecting two or more circuit boards. The interconnect comprises a substrate having one or more resilient elements of a non-conductive material and having opposite contact surfaces. A flexible conductive coating is provided on the contact surfaces of the resilient elements and extends between the contact surfaces to provide electrical connection therebetween. In one embodiment each element is integrally formed with a resilient substrate and has electrically conductive contact surfaces which are outward of the respective substrate surfaces and are electrically connected through a conductive surface which extends through vias or openings formed in the substrate. In another embodiment, each element is individually formed and is disposed within a corresponding cavity of a separate substrate.

Abstract: An electrical device is provided having a conductive coating or layer chemically grafted to a support substrate to produce a durable, conductive surface permanently attached to the underlying substrate material. The grafted layer can be embodied in an electrical contact, and can also be embodied as electrical traces and contact areas of circuit boards and electrical and electronic devices and components. In another embodiment, the grafted layer can be provided in an RFI/EMI shield or ground plane.

Abstract: The present invention comprises an electrical contact having solid homogenous conductive particles on the contact surface. The particles are of greater hardness than that of the contact material to deform the contact material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact surface by a technique which results in the particles being intimately bonded to the contact surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.

Abstract: A method for manufacturing hygristors includes preparing a hygroscopic gel containing a substantially greater proportion of carbon than the prior art, and milling the gel for a period of at least 24 hours to produce a smooth mixture. Substrates are dipped into the milled gel at controlled rates to coat the substrates. The coated substrates are cured under controlled temperature and humidity. Adhesion of the coating is improved by the smoother mixture resulting from the longer milling time, and by the differences in components of the mixture compared to the prior art. Long term stability and dynamic range are both increased.