Abstract: A decapping apparatus is provided for removing the cap portions of cerquad packaged and similarly packaged integrated circuits. The decapping apparatus applies a controlled force in the glass interface area of the packaged integrated circuit to remove the cap of the package while maintaining the integrity of the wire leads and of the ceramic base and cap sections. Furthermore, glass fragments and other debris are prevented from contacting the semiconductor chip that is mounted within the package. The decapping apparatus may include a first blade having a chisel portion and a second blade having a chisel portion and a blocking wall that oppose the chisel portion of the first blade. The first blade and the second blade may abut against a plurality of wire leads that extend between the main body section and a ring section of the packaged integrated circuit.