Abstract: Retractable protection apparatus, and methods for use, provide protection for vertically oriented electrical connection pins from unintended bending, while further providing operability that allows protected pins to be uncovered to at least the extent necessary to make electrical connection with one or more connectors, and covered after coupling with the connectors is no longer required. In a further aspect, a locking mechanism is provided to prevent the retractable protection mechanism from retracting during shipping or similar handling. In a still further aspect, the retractable protection apparatus is segmented so that only selected portions of the vertically oriented electrical connection pins may be exposed for electrical access.

Abstract: The present invention comprises an in-line mixer apparatus for creating output emulsions, homogeneous blends, suspensions and dispersions of pharmaceutical, biological, cosmetic, chemical and food compositions. The mixer includes a drive motor arranged around a support, the motor having an output shaft extending therefrom which is connectable to a drive head. A seal hub is arranged around the shaft, and a plurality of alternation foraminous stator plates and rotors are also arranged about the shaft. An inlet and an emulsion or dispersion discharge is arranged in the drive head. Each of the rotors comprises a plurality of projections for improved compound flow therepast, each projection having a leading cutting edge blade arranged at an acute angle with respect to a frame portion of said rotor member.

Abstract: A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.