Abstract: The present invention is an apparatus and method for controlling the temperature of a heat generating device. The invention is particularly adaptable to controlling the temperature of an integrated circuit under test. In one embodiment the invention involves the use of a bellows having a heat slug disposed at one end that is adapted to engage a surface of the heat generating device. The bellows is compliant and includes a cavity containing a heat transfer medium. The bellows cavity is in fluid communication with a heat transfer medium reservoir. Heat is transferred from the heat generating device by engaging the heat slug with a surface of the heat generating device and applying a force to the bellows. The compliant nature of the bellows provides the temperature control apparatus with a self-planarizing feature that maximizes the contact surface area between the heat slug and heat generating device.