Patents by Inventor David R. Kiefer

David R. Kiefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density interconnect apparatus
    Patent number: 5211565
    Abstract: The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.
    Type: Grant
    Filed: March 19, 1992
    Date of Patent: May 18, 1993
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, Carl D. Breske, David J. Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore, Jr., Michael R. Edwards, Bricky A. Stephenson, Anthony A. Vacca
  • High density interconnect apparatus
    Patent number: 5167511
    Abstract: The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.
    Type: Grant
    Filed: November 27, 1990
    Date of Patent: December 1, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, Carl D. Breske, David J. Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore, Jr., Michael R. Edwards, Bricky A. Stephenson, Anthony A. Vacca