Abstract: An additive delivery laminate, suitable for cooking a food product and transferring a colorant, flavorant, and/or odorant to a food product, has an additive delivery layer comprising a thermoplastic layer and water-soluble granules containing a food additive. The laminate further comprises a substrate layer to which the additive delivery layer is bonded. The additive delivery layer is placed in contact with the food product to be packaged, with the granules thereafter dissolving and the additive being transferred to the food product. The additive can be transferred during cook-in or otherwise. Also disclosed is a process for preparing the additive delivery laminate and a process for preparing a packaged food product.

Abstract: An additive delivery laminate is suitable for packaging a food product which is cooked in the package, with an additive transferring from the laminate to the food product. The additive delivery laminate has a substrate and an additive delivery layer. The additive delivery layer contains styrene-ethylene/butylene-styrene copolymer and additive granules containing a colorant, flavorant, and/or odorant. The styrene-ethylene/butylene-styrene copolymer has a styrene to ethylene/butylene weight ratio of from 5:95 to 50:50 and a Brookfield Viscosity of from 500 to 100,000 centipoise measured as a 25 weight percent solution in toluene at 77° F.

Abstract: A packaged food product includes a food product and a package enclosing the food product. The package may be formed from a coated, printed film that includes a substrate film including one or more thermoplastic materials and having an average thickness of less than about 15 mils. An image is printed on the print side of the substrate film. A radiation-cured varnish covers the printed image. The radiation-cured varnish was formed by coating the printed image with a radiation-curable varnish that includes one or more polymerizable reactants and optionally one or more photointiators. The radiation-curable varnish is subsequently exposed to radiation sufficient to polymerize at least 90 weight % of the polymerizable reactants. When the coated, printed film is tested according to the FDA migration test protocol, no more than 50 parts per billion total of any of the polymerizable reactants and the optional photoinitiators migrate within 10 days at 40° C.

Abstract: A dual curing composition is prepared from components consisting essentially of(a) an isocyanate adduct having (i) free isocyanate groups and (ii) free photopolymerizable ethylenically unsaturated groups, wherein the ethylenically unsaturated groups comprise in the range of 10 to 70% of the total of any free functional groups on said adduct;(b) reactive (meth)acrylate diluents; and(c) optionally, photoinitiator.When cured, the above composition is particularly suitable as a conformal coating on electronic circuit boards.

Abstract: This invention relates to a heat curable composition comprising(a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(b) an epoxy resin containing at least two ##STR2## groups, and (c) a thermal initiator member of the group consisting of(1) a substituted or unsubstituted diaryliodonium salt in combination with a free radical initiator,(2) a BF.sub.3 adduct,(3) a BF.sub.3 adduct in combination with a free radical initiator, and(4) dicyandiamide in combination with a free radical initiator.The system is stable at ordinary temperatures, but on heating the thermal initiator catalyzes the curing of the acrylate and the epoxy resin.

Abstract: This invention relates to a heat curable composition comprising(a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(b) an epoxy resin containing at least two ##STR2## groups, and (c) a thermal initiator member of the group consisting of(1) a substituted or unsubstituted diaryliodonium salt in combination with a free radical initiator,(2) a BF.sub.3 adduct,(3) a BF.sub.3 adduct in combination with a free radical initiator, and(4) dicyandiamide in combination with a free radical initiator.The system is stable at ordinary temperatures, but on heating the thermal initiator catalyzes the curing of the acrylate and the epoxy resin.