Abstract: A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.

Abstract: The invention is directed to a method and apparatus for covering open-top truck trailers used to haul wood chips and the like. A flexible cover is pulled over the open top of a trailer via a shaft rotatable between a first and second position; a projection extending from the shaft and configured to engage the flexible cover when the shaft is in a first position and to disengage the flexible cover when the shaft is in a second position; and a counterweight extending from said shaft and configured to rotate the shaft from a second position to a first position.