Patents by Inventor David R. Pugne

David R. Pugne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090076222
    Abstract: A coating composition comprising a polycarbonate-based polyurethane, and a polyester-based polyurethane, which is substantially free of siloxane compounds, wherein when the coating composition is applied to a substrate, dried, and crosslinked, it has a delta E of less than 3.0 after exposure to 1240kJ/m2 of ultraviolet light. In a more preferred embodiment of the present invention, the delta E is less than 2.0.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 19, 2009
    Inventor: David R. Pugne
  • Patent number: 6749938
    Abstract: What is disclosed is a 2-part epoxy adhesive composition comprises an epoxy compound, an optional amine hardener, optional hydroxy-substituted aromatic compound, and from 20% to 60% of the total weight of adhesive combined of liquid terminal epoxy reactive groups and amidoamine, whereby the adhesive is applied as a mixture of first and second parts in a volume ratio of the first epoxy part: second cure part of 1:1.4 to 1:3.0. The adhesive is adapted to provide bonding of SMC with low or no read-through, initial and aged fiber tearing bonds and specified bond strength minimum at 400° F. (204° C.).
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: June 15, 2004
    Assignee: Lord Corporation
    Inventors: Dennis J. Damico, David R. Pugne
  • Publication number: 20030121606
    Abstract: What is disclosed is a 2-part epoxy adhesive composition comprises an epoxy compound, an optional amine hardener, optional hydroxy-substituted aromatic compound, and from 20% to 60% of the total weight of adhesive combined of liquid terminal epoxy reactive groups and amidoamine, whereby the adhesive is applied as a mixture of first and second parts in a volume ratio of the first epoxy part: second cure part of 1:1.4 to 1:3.0. The adhesive is adapted to provide bonding of SMC with low or no read-through, initial and aged fiber tearing bonds and specified bond strength minimum at 400° F. (204° C.).
    Type: Application
    Filed: November 13, 2001
    Publication date: July 3, 2003
    Applicant: Lord Corporation
    Inventors: Dennis J. Damico, David R. Pugne