Abstract: A hermetic enclosure for an electrical component, particularly for a tantalum capacitor, and a method of forming it is disclosed. A silver container is provided having an open end at which an outwardly protruding flange is formed. A quantity of sealing glass is sealed to a lead and formed into a bead about the lead intermediate the ends thereof. A metallic member having an aperture therein is provided and the bead is sealed to the surface of the aperture bordering portion of the metallic member. A silver ring is disposed on the surface of the metallic member and the peripheral portion of the metallic member is folded over and pressed into a portion of the silver ring to form a compression seal therebetween. This assembly is disposed adjacent the outwardly protruding flange of the container with the lead extending from within the container to the exterior thereof.