Patents by Inventor David Razu

David Razu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level package and fabrication method
    Patent number: 10665567
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: May 26, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 9871015
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: January 16, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 9406645
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: August 2, 2016
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 9054117
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: June 9, 2015
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 8952522
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: February 10, 2015
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 8710649
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: April 29, 2014
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 8691632
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: April 8, 2014
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 8486764
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: July 16, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 8298866
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: October 30, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package fabrication method
    Patent number: 8119455
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: February 21, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Electronic component package comprising fan-out traces
    Patent number: 7932595
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: April 26, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Electronic component package comprising fan-out and fan-in traces
    Patent number: 7714431
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: May 11, 2010
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 7192807
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: March 20, 2007
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu
  • Wafer level package and fabrication method
    Patent number: 6905914
    Abstract: A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: June 14, 2005
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Razu