Abstract: The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.

Abstract: The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.

Abstract: A method for fabricating a printed-circuit board includes the steps of loading components onto the printed circuit board, and placing a pin array over the components. Each pin is free to move "downward," and each component has at least one pin pressing on it to hold the component in place. Each component also preferably has a pin on each side of it, to hold it against lateral movement. The pin support arrangement is dimensioned so that a gap or space exists between the support and the component side of the board. Heat is applied to the gap, and flows through the interstices between the pins to heat the solder on the upper side of the board to fuse the solder and make the desired connections.