Abstract: Fiber pistoning apparatus and methods of use are provided. A fiber anti-pistoning apparatus includes an axial centerline, and an elongate main body that at least partially surrounds the axial centerline and extends from a first end to a second end of the elongate main body. The elongate main body defines a channel that extends along the axial centerline for housing a bundle of fibers. The channel extends between a first opening at the first end, a second opening at the second end, and a slotted opening between the first end and the second end for receiving the bundle of fibers. The elongate main body includes one or more retention features for coupling to a first buffer tube.

Abstract: Fiber pistoning apparatus and methods of use are provided. A fiber anti-pistoning apparatus includes an axial centerline, and an elongate main body that at least partially surrounds the axial centerline and extends from a first end to a second end of the elongate main body. The elongate main body defines a channel that extends along the axial centerline for housing a bundle of fibers. The channel extends between a first opening at the first end, a second opening at the second end, and a slotted opening between the first end and the second end for receiving the bundle of fibers. The elongate main body includes one or more retention features for coupling to a first buffer tube.

Abstract: A fiber optic splice enclosure includes a basket. The basket includes an outer shell, the outer shell including an outer sidewall defining at least a portion of a periphery of the basket. The basket further includes an insert disposed within the outer shell, the insert including a first sidewall and a second sidewall spaced apart from each other along a transverse axis and each extending along a longitudinal axis to define an inner channel therebetween. The first sidewall and the second sidewall are each further spaced apart from the outer sidewall along the longitudinal axis to define a first outer channel and a second outer channel. The fiber optic splice enclosure further includes a splice tray assembly including at least one splice tray, the splice tray assembly disposed within the inner channel.

Abstract: A fiber optic splice enclosure includes a basket. The basket includes an outer shell, the outer shell including an outer sidewall defining at least a portion of a periphery of the basket. The basket further includes an insert disposed within the outer shell, the insert including a first sidewall and a second sidewall spaced apart from each other along a transverse axis and each extending along a longitudinal axis to define an inner channel therebetween. The first sidewall and the second sidewall are each further spaced apart from the outer sidewall along the longitudinal axis to define a first outer channel and a second outer channel. The fiber optic splice enclosure further includes a splice tray assembly including at least one splice tray, the splice tray assembly disposed within the inner channel.

Abstract: A fiber optic splice enclosure includes a basket. The basket includes an outer shell, the outer shell including an outer sidewall defining at least a portion of a periphery of the basket. The basket further includes an insert disposed within the outer shell, the insert including a first sidewall and a second sidewall spaced apart from each other along a transverse axis and each extending along a longitudinal axis to define an inner channel therebetween. The first sidewall and the second sidewall are each further spaced apart from the outer sidewall along the longitudinal axis to define a first outer channel and a second outer channel. The fiber optic splice enclosure further includes a splice tray assembly including at least one splice tray, the splice tray assembly disposed within the inner channel.

Abstract: An apparatus for connecting buffer tubes including a first block, a second block, and a fastener for assembling said first and second blocks. The blocks contain a pair of tube grooves and a cavity and a and a hole leading into the cavity. A sealant is then inserted into the cavities and allowed to cure.

Abstract: A fiber optic splice tray that has an increased fiber capacity and maximizes bend radius. The fiber optic splice tray has multiple manifolds that are stacked on top of each other to form manifold stacks. Also, the fiber optic splice tray has two sets of manifold stacks.

Abstract: An apparatus for connecting buffer tubes including a first block, a second block, and a fastener for assembling said first and second blocks. The blocks contain a pair of tube grooves and a cavity and a and a hole leading into the cavity. A sealant is then inserted into the cavities and allowed to cure.

Abstract: A fiber optic splice tray that has an increased fiber capacity and maximizes bend radius. The fiber optic splice tray has multiple manifolds that are stacked on top of each other to form manifold stacks. Also, the fiber optic splice tray has two sets of manifold stacks.

Abstract: The thickness of a silicon wafer (3) within a processing vacuum enclosure (1) is measured or monitored by an optical apparatus (50) via a window (4). The optical apparatus (5) comprises a laser which is tuneable across a range of wavelengths while maintaining a narrow bandwidth. The optical apparatus (5) also includes a detector receiving reflected light. The wavelength variation produces interference effects which are used, by examination of the detector output, to give a measure of thickness or other parameters.

Abstract: A low-pressure processing vessel (3) used for the production of semiconductors is provided with a light-sensitive detector (1) at a distance from the reaction site, for example in the exhaust line (2). The detector (1) is used to detect light emitted by an intermediate which relaxes or recombines with the emission of light at a characteristic wavelength, the intermediate having a long lifetime such that the detector (1) can be positioned in a relatively remote location.

Abstract: This invention relates to the control of etch and deposition processes in the manufacture of semiconductor devices, microelectronic machines (MEMs), and waveguides.