Patents by Inventor David Reusch

David Reusch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radius filler for composite structure
    Patent number: 10744722
    Abstract: A radius filler includes a plurality of fibers encapsulated in resin and braided into a braided radius filler. The braided radius filler has a substantially triangular shape with concave radius filler side surfaces and a substantially planar radius filler base surface.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: August 18, 2020
    Assignee: The Boeing Company
    Inventors: Angelo Rossi, Jeffery L. Marcoe, Marc R. Matsen, Aaron W. Bartel, Waeil M. Ashmawi, Sahrudine Apdalhaliem, Adriana Willempje Blom-Schieber, David Reusch
  • RADIUS FILLER FOR COMPOSITE STRUCTURE
    Publication number: 20180065314
    Abstract: A radius filler includes a plurality of fibers encapsulated in resin and braided into a braided radius filler. The braided radius filler has a substantially triangular shape with concave radius filler side surfaces and a substantially planar radius filler base surface.
    Type: Application
    Filed: October 30, 2017
    Publication date: March 8, 2018
    Inventors: Angelo Rossi, Jeffery L. Marcoe, Marc R. Matsen, Aaron W. Bartel, Waeil M. Ashmawi, Sahrudine Apdalhaliem, Adriana Willempje Blom-Schieber, David Reusch
  • RADIUS FILLER AND METHOD OF MANUFACTURING SAME
    Publication number: 20150217508
    Abstract: A method of manufacturing a radius filler may include providing a plurality of fibers, braiding the plurality of fibers into a braided preform, shaping the braided preform into a braided radius filler, and cutting the braided radius filler to a desired length.
    Type: Application
    Filed: February 4, 2014
    Publication date: August 6, 2015
    Applicant: The Boeing Company
    Inventors: Angelo Rossi, Waeil M. Ashmawi, Sahrudine Apdalhaliem, Jeffery L. Marcoe, Marc R. Matsen, Aaron W. Bartel, Adriana Willempje Blom, David Reusch
  • Parasitic inductance reduction for multilayered board layout designs with semiconductor devices
    Patent number: 9035417
    Abstract: A highly efficient, single sided circuit board layout design providing magnetic field self-cancellation and reduced parasitic inductance independent of board thickness. The low profile power loop extends through active and passive devices on the top layer of the circuit board, with vias connecting the power loop to a return path in an inner layer of the board. The magnetic effect of the portion of the power loop on the top layer is reduced by locating the inner layer return path directly underneath the power loop path on the top layer.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: May 19, 2015
    Assignee: Efficient Power Conversion Corporation
    Inventors: David Reusch, Johan Tjeerd Strydom
  • PARASITIC INDUCTANCE REDUCTION FOR MULTILAYERED BOARD LAYOUT DESIGNS WITH SEMICONDUCTOR DEVICES
    Publication number: 20140183550
    Abstract: A highly efficient, single sided circuit board layout design providing magnetic field self-cancellation and reduced parasitic inductance independent of board thickness. The low profile power loop extends through active and passive devices on the top layer of the circuit board, with vias connecting the power loop to a return path in an inner layer of the board. The magnetic effect of the portion of the power loop on the top layer is reduced by locating the inner layer return path directly underneath the power loop path on the top layer.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: Efficient Power Conversion Corporation
    Inventors: David Reusch, Johan Tjeerd Strydom