Patents by Inventor David Ries Hembree

David Ries Hembree has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die test carrier having conductive elastomeric interposer
    Patent number: 6583635
    Abstract: A test carrier and method for testing semiconductor die. The test carrier includes a base containing a cavity into which an anisotropically conductive elastomeric/resilient interposer and interconnector are inserted. A die is then placed in the cavity as the unit under test, and a cover secures the content of the entire cavity. Electrical communication between a die and an external test device is established through the interconnector and the anisotropically elastomeric conductive interposer. The test carrier permits the die to be burned-in and electrically tested prior to assembly.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: June 24, 2003
    Assignee: Micron Technology, Inc.
    Inventors: David Ries Hembree, Alan G. Wood
  • Semiconductor die test carrier having conductive elastomeric interposer
    Publication number: 20020130677
    Abstract: A test carrier and method for testing semiconductor die. The test carrier includes a base containing a cavity into which an anisotropically conductive elastomeric/resilient interposer and interconnector are inserted. A die is then placed in the cavity as the unit under test, and a cover secures the content of the entire cavity. Electrical communication between a die and an external test device is established through the interconnector and the anisotropically elastomeric conductive interposer. The test carrier permits the die to be burned-in and electrically tested prior to assembly.
    Type: Application
    Filed: March 15, 2001
    Publication date: September 19, 2002
    Inventors: David Ries Hembree, Alan G. Wood