Abstract: The present disclosure is drawn to wirebonding for optical engines having side-mounted optoelectronic components. An integrated circuit is mounted on a first surface of a substrate block, and an optoelectronic component is positioned on a second surface of the substrate block and is oriented to emit light in a direction parallel to a plane defined by the first surface. A wirebond is drawn between the integrated circuit and a base substrate on which the substrate block is mounted. A optoelectronic component is then contacted with the wirebond, and a portion of the wirebond between the optoelectronic component and the base substrate is removed.

Abstract: The present disclosure provides methods and systems for assigning a network topology to an interconnection network. Data is transmitted along at least one of a plurality of output ports based on a first port map, the first port map linking at least one of a plurality of input ports to at least one of the output ports. A request to apply a second port map, different from the first port map, is received. A circuit-switched element is activated to link at least one of the plurality of input ports to at least one of the plurality of the output ports based on the second port map. The data is transmitted along the at least one of the plurality of output ports based on the second port map.

Abstract: The present disclosure is drawn to wirebonding for optical engines having side-mounted optoelectronic components. An integrated circuit is mounted on a first surface of a substrate block, and an optoelectronic component is positioned on a second surface of the substrate block and is oriented to emit light in a direction parallel to a plane defined by the first surface. A wirebond is drawn between the integrated circuit and a base substrate on which the substrate block is mounted. A optoelectronic component is then contacted with the wirebond, and a portion of the wirebond between the optoelectronic component and the base substrate is removed.

Abstract: There is described an optical connector comprising a casing having a hollow body and at least one aperture at one end thereof, at least one optical fiber having an outer surface and a fiber end and extending inside the hollow body of the casing along a longitudinal direction thereof, a connector assembly supporting the at least one optical fiber in the casing and aligning the fiber end with the at least one aperture, and an optical monitoring device comprising at least one photodetector in proximity to the fiber end of the at least one optical fiber and adapted to detect naturally leaked light from the fiber end. An optical monitoring device and a method for monitoring optical power in an optical connector are also described.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: There is provided a mating clip for securing a connection between an optical connector and an optical port of a hybrid optically enabled integrated circuit package, the optical connector having an optical cable end to which is attached an optical cable and having a connector end opposite the optical cable end, the mating clip comprising: a cover for substantially covering the optical connector, the cover comprising an opening to permit passage of the optical cable; an S-shaped curved feature extending from the cover and for applying a force against the optical cable end; and a hook-shaped feature extending from the cover in the direction of the connector end of the optical connector and for securing an assembly formed by the mating clip and the optical connector to the optical port; wherein, in the securing of mating clip/optical connector assembly, the hook-shaped feature interacts with at least one of a notch internal to the hybrid optically enabled integrated circuit package; and a protrusion on the optica

Abstract: An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

Abstract: A method and apparatus is disclosed for enabling a coupling of at least one optical fiber with an optoelectronic device. The apparatus comprises at least one v-groove for receiving at least one optical fiber. A first end of the apparatus is then polished at a predetermined angle in order to enable an optical coupling with the optoelectronic device.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: An optical connector and a manufacturing method are disclosed. The method for manufacturing an optical connector achieving a mechanical coupling comprises embedding a length of at least one optical fiber in a body to form an assembly. It also comprises to remove, at a first end of the assembly, a portion to provide a beveled surface on a corresponding first end of the optical fiber at which light is reflected for a side coupling. Also, at a portion of a side of the assembly near the first end, the method comprises creating an optical surface to provide a flat coupling surface for said side coupling. The method also comprises removing, at a second end of the assembly, a portion to provide a flat abutment surface including a corresponding second end of the at least one optical fiber. The method also comprises providing at the second end of the assembly a mating structure for precision connecting with a complementary connector in which an optical waveguide is end-coupled with at least one of the optical fiber.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: A method and an apparatus are provided for synchronizing clock signals in spatially distributed nodes in large, synchronous electronic, optical, optoelectronic or wireless systems, such as systems comprising arrays of microprocessors and memories, and telecommunication systems. The nodes comprise a master node and a plurality of slave nodes. The master node generates first and second identical pulse trains and propagates them to the slave nodes via a first and second propagation channels, respectively, so that a pair of pulses, one from each pulse train, arrive at each slave node substantially simultaneously, travelling in opposite directions. Each slave node generates a clock signal event in response to the substantially simultaneous arrival of each pair of pulses. The master node maintains the rate of the two pulse trains such that there are “pN” pulses in each propagation channel at any time, where “N” is the number of nodes and “p” is an integer.

Abstract: A process for preparing a lignosulfonate additive for use as a dispersant in cement or concrete compositions comprises treating a lignosulfonate solution with salts of trivalent metals. Preferably, such salts comprise nitrates or sulphates of aluminum, iron, copper, or manganese.

Abstract: To synchronize clock signals in spatially distributed nodes in a large, synchronous electronic, optical, optoelectronic or wireless system, a master node generates two identical pulse trains and propagates them to a plurality of slave nodes via first and second propagation channels, respectively, so that a pair of pulses, one from each pulse train, arrive at each slave node simultaneously, travelling in opposite directions. Each slave node generates a clock signal event when the pair of pulses arrive substantially simultaneous. When the pulses in the two channels do not arrive simultaneously, the slave node adjusts delays in each propagation channel so as to adjust arrival times of subsequent pairs of pulses. The delays may comprise pre-delays upstream of the detection point and post-delays downstream of the detection point, any increment in a pre-delay being compensated by an equal decrement in the post-delay in the same propagation channel.