Abstract: A conveyor assembly includes an extendable conveyor, a cradle configured to at least partially receive the extendable conveyor, a first conveyor that is movable between a first position and a second position, the first conveyor configured to receive a material from a first source, and second conveyor configured to receive a material from a second source. The extendable conveyor may be configured to pivot with respect to the cradle.

Abstract: A conveyor assembly includes an extendable conveyor, a cradle configured to at least partially receive the extendable conveyor, a first conveyor that is movable between a first position and a second position, the first conveyor configured to receive a material from a first source, and second conveyor configured to receive a material from a second source. The extendable conveyor may be configured to pivot with respect to the cradle.

Abstract: A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.

Abstract: A cover or lid assembly is provided for EMI/RFI shielding. The cover or lid is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame, disposed about the electronic component. The conductive frame is electrically connected to the ground. An electrically conductive adhesive is disposed continuously between the frame and the lid to mount the lid to the conductive frame to shield the electronic component from electromagnetic and radio frequency interference.

Abstract: A Faraday cage is provided for EMI/RFI shielding which includes a substrate having an electrical ground; at least one electronic component electrically connected to the substrate; a conductive housing; and an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways are filled with a non-conductive adhesive resin. The conductive housing is adhesively electrically mounted to the electrical ground of the substrate, over the electronic component, to shield electromagnetic and radio frequency interference.