Abstract: The ability to efficiently and reliably transmit, route and receive data across telecommunication networks is essential for existing and evolving applications where connectivity to these networks is a ubiquitous aspect of society today. However, limitations in existing telecommunication networks impact this through performance, cost, and speed. To address this the inventor has established improvements with respect to routing (switching), processing, and monitoring. For routing low latency switch architectures for improving packet-based data switching are described. For processing digital optical logic devices and digital optical processing structures for enhanced functionality and processing within optical telecommunication networks are described. For monitoring improved optical connectors which provide embedded monitoring and analytical functionality for improved management of optical telecommunication networks are described.

Abstract: The ability to efficiently and reliably transmit, route and receive data across telecommunication networks is essential for existing and evolving applications where connectivity to these networks is a ubiquitous aspect of society today. However, limitations in existing telecommunication networks impact this through performance, cost, and speed. To address this the inventor has established improvements with respect to routing (switching), processing, and monitoring. For routing low latency switch architectures for improving packet-based data switching are described. For processing digital optical logic devices and digital optical processing structures for enhanced functionality and processing within optical telecommunication networks are described. For monitoring improved optical connectors which provide embedded monitoring and analytical functionality for improved management of optical telecommunication networks are described.

Abstract: The ability to efficiently and reliably transmit, route and receive data across telecommunication networks is essential for existing and evolving applications where connectivity to these networks is a ubiquitous aspect of society today. However, limitations in existing telecommunication networks impact this through performance, cost, and speed. To address this the inventor has established improvements with respect to routing (switching), processing, and monitoring. For routing low latency switch architectures for improving packet-based data switching are described. For processing digital optical logic devices and digital optical processing structures for enhanced functionality and processing within optical telecommunication networks are described. For monitoring improved optical connectors which provide embedded monitoring and analytical functionality for improved management of optical telecommunication networks are described.

Abstract: The ability to efficiently and reliably transmit, route and receive data across telecommunication networks is essential for existing and evolving applications where connectivity to these networks is a ubiquitous aspect of society today. However, limitations in existing telecommunication networks impact this through performance, cost, and speed. To address this the inventor has established improvements with respect to routing (switching), processing, and monitoring. For routing low latency switch architectures for improving packet-based data switching are described. For processing digital optical logic devices and digital optical processing structures for enhanced functionality and processing within optical telecommunication networks are described. For monitoring improved optical connectors which provide embedded monitoring and analytical functionality for improved management of optical telecommunication networks are described.

Abstract: An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

Abstract: A system for heating food includes a heated surface which may comprise a mineral an organic resin and any of a number of suitable inorganic or organic fillers.

Abstract: The present description relates to a food container which comprises at least one opening through which food is moved and a humidity source in fluid contact with an air stream providing humidity to the air stream. The air stream is directed across the opening to form a barrier between the interior of the container and the exterior environment.

Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.

Abstract: A food container is shown having a plurality of openings used to move food into and/or out of the container. Each of the openings has an air curtain positioned across the opening. The air curtains form barriers between the interior of the container and the exterior environment. The food container may be capable of humidifying and/or heating food positioned therein.

Abstract: The present description relates to a food container which comprises at least one opening through which food is moved and a humidity source in fluid contact with an air stream providing humidity to the air stream. The air stream is directed across the opening to form a barrier between the interior of the container and the exterior environment.

Abstract: The present invention relates to a system comprising at least one serving dish configured to support food and a power source which comprises at least one portable electrical power generating device. The power source provides power to heat the food.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: A monolithic semiconductor photo-coupler device comprises a substrate made of semiconductor material, and a groove made in one face of the substrate to receive and align an optical fiber. A wall of given thickness is formed in the semiconductor material of the substrate in the prolongation of the groove and transversally to this groove. The wall has, on the side of the groove, a first face generally perpendicular to the groove, and a second face opposite to the first face. The semiconductor material preferably comprises silicon whereby p-doped and n-doped regions can be produced on the first and second faces of the wall, respectively. These p- and n-doped regions are separated by an intrinsic semiconductor region. Finally, first and second electrodes are applied to the substrate in contact with the p- and n-doped regions.

Abstract: The present invention relates to a laminated conductor assembly comprising an input section, an output section, and a superposition of alternate electrically conducting and electrically insulating layers. The electrically conducting layers present a geometry which defines both capacitive and inductive structures, and these capacitive and inductive structures form, between the input and output sections, a capacitive and inductive frequency-filtering circuit. The electrically conducting layers comprise respective superposed first end portions for defining first capacitive structures, respective superposed second end portions opposite to the first end portions for defining second capacitive structures, and respective narrower bridge portions for interconnecting the first and second end portions of the corresponding electrically conducting layers, wherein these narrower bridge portions define respective inductive structures. Preferably, the narrower bridge portions are laterally offset with respect to each other.

Abstract: A ferrule for holding an array of optical fiber sections comprises a longitudinal cavity and an edge face. The longitudinal cavity receives the array of fiber sections with the end faces thereof arranged in a line and coplanar to each other. The edge face includes a first face portion perpendicular to the longitudinal axes of the fiber sections, and a second bevelled face portion adjacent to the first face portion. The end faces of the fiber sections emerge from the first face portion. The ferrule is used in a connector structure including a bar with a top surface on which optoelectronic devices are arranged in a line and bonding contacts are disposed. An alignment assembly between the ferrule and the bar aligns the end faces of the fiber sections with respective optoelectronic devices. The bevelled face portion provides for clearance to enable unobstructed passage of wire-bonds connected to the bonding contacts.

Abstract: The present invention relates to a laminated conductor assembly comprising an input section, an output section, and a superposition of alternate electrically conducting and electrically insulating layers. The electrically conducting layers present a geometry which defines both capacitive and inductive structures, and these capacitive and inductive structures form, between the input and output sections, a capacitive and inductive frequency-filtering circuit. The electrically conducting layers comprise respective superposed first end portions for defining first capacitive structures, respective superposed second end portions opposite to the first end portions for defining second capacitive structures, and respective narrower bridge portions for interconnecting the first and second end portions of the corresponding electrically conducting layers, wherein these narrower bridge portions define respective inductive structures. Preferably, the narrower bridge portions are laterally offset with respect to each other.