Patents by Inventor David Rosenboom

David Rosenboom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220209440
    Abstract: A structure of a connection of a cable and a circuit board, an assembly method, and a connector are provided. The structure of the connection of the cable and the circuit board is applied to connecting the cable and the circuit board. The cable is soldered onto the circuit board. The structure of the connection of the cable and the circuit board further includes a housing. The housing is mounted on the circuit board and covers bonding pads and/or non-bonding pad areas of the cable and the circuit board. A clearance is reserved between the opposite sides of the housing and the cable, or the opposite sides of the housing and the cable are attached to each other, or a covering layer is padded between the opposite sides of the housing and the cable.
    Type: Application
    Filed: May 18, 2021
    Publication date: June 30, 2022
    Applicant: Amphenol AssembleTech(Xiamen) Co.,Ltd
    Inventors: Wenchu YANG, David ROSENBOOM, Jesus JARAMILLO, Xiaodong WANG, Shujian WANG, Minjie ZHOU, Hang LI
  • Patent number: 11282618
    Abstract: A high-speed flat cable includes a plurality of shielded signal units, one or more bendable composite layers, and an adhesive layer. The shielded signal units are substantially coplanar, spaced apart from each other or adjoining each other. The one or more bendable composite layers includes an inner insulating film layer, a bendable aluminum foil layer, and an outer insulating film layer. The one or more bendable composite layers composed of the inner insulating film layer, the bendable aluminum foil layer, and the outer insulating film layer increase its mechanical bending/folding property to improve the bending/folding memory. The one or more bendable composite layers allows the flat cable to be bent with ease without rebounding, thereby enhancing production efficiency.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: March 22, 2022
    Assignee: Amphenol AssembleTech (Xiamen) Co., Ltd
    Inventors: Wen Chu Yang, Zhi Ming Huang, David Rosenboom, Jesus Jaramillo
  • Publication number: 20200185124
    Abstract: A high-speed flat cable having a better bending/folding memory and a manufacturing method thereof are provided. The high-speed flat cable includes a plurality of shielded signal units, one or more bendable composite layers, and an adhesive layer. The shielded signal units are substantially coplanar, spaced apart from each other or adjoining each other. The one or more bendable composite layers includes an inner insulating film layer, a bendable aluminum foil layer, and an outer insulating film layer. The one or more bendable composite layers composed of the inner insulating film layer, the bendable aluminum foil layer, and the outer insulating film layer increase its mechanical bending/folding property to improve the bending/folding memory. The one or more bendable composite layers allow the flat cable to be bent with ease without rebounding, thereby enhancing production efficiency.
    Type: Application
    Filed: November 14, 2017
    Publication date: June 11, 2020
    Applicant: Amphenol Assemble Tech Co., Ltd
    Inventors: Wen Chu Yang, Zhi Ming Huang, David Rosenboom, Jesse Jaramillo