Abstract: A method of mounting a banana-type electrical receptacle on the substrate includes the steps of placing the electrical receptacle over an aperture formed in the substrate with support ribs formed on the outer surface of the receptacle supporting the receptacle over the aperture. A deformable electrical lead extends from a centrally disposed conductive member making an electrical connection with an electrical contact on the substrate. The electrical lead is affixed to the electrical contact on the substrate and the receptacle is inserted into the aperture crushing or shearing the support ribs and the deforming the electrical lead. Alignment ribs formed on the outer surface of the receptacle have shoulders that contact the substrate for positioning the receptacle in the substrate. The mounting method is compatible with automated soldering processes, such as wave flow soldering.

Abstract: An electrical receptacle mountable on and positionable within a substrate has an electrically conductive element that includes a conductive member with deformable electrical leads extending therefrom. The deformable electrical leads have first and second portions with the first portion extending outward from the conductive member and the second portion being adjacent to and approximately parallel with the conductive member. A body of electrically insulating material encapsulates the conductive member about the exterior surface of the conductor with the electrically insulating material having an exterior surface on which is formed support ribs and alignment ribs with the support ribs providing initial support for the electrical receptacle over an aperture formed in the substrate and the alignment ribs providing positioning alignment of the electrical receptacle within the aperture of the substrate.