Abstract: A method and apparatus for heat sinking for multiple high power circuit board modules, is provided. One implementation involves providing a compact nested fin integral heat sink assembly for each high power circuit board module, and positioning fin sections on the heat sink assembly such that a plurality of nested fin sections emanate from each board side heat spreader plate of the assembly, thereby providing efficient airflow gap, pressure drop, and heat sink base spreading performance. The fin section can be placed essentially directly over high power components on each board module to minimize spreading resistance in a heat sink base of the assembly. The fin sections on each board module side provide channel depth without extending from an opposite side heat sink base, thereby increasing fin surface area for each local region of fins from either heat sink base.

Abstract: A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in thermal contact with (e.g., through an elastomerically compressive pad thermal interface material) electronic components mounted on the circuit board's top surface. An articulated coldplate is positioned over and in thermal contact with at least one electronic component mounted on the circuit board's top surface. In the preferred embodiments, the articulated coldplate is spring-loaded against one or more high power processor components having power dissipation greater than that of the electronic components under the fixed-gap cooling plate. Thermal dissipation channels in the coldplates are interconnected by flexible tubing, such as copper tubing with a free-expansion loop.

Abstract: A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits.

Abstract: A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits.

Abstract: An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Abstract: An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.