Patents by Inventor David Ryan Hobby

David Ryan Hobby has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for laser diode array having integrated microchannel cooling
    Patent number: 11962129
    Abstract: The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: April 16, 2024
    Assignees: Lawrence Livermore National Security, LLC, Colorado State University Research Foundation
    Inventors: Jack Kotovsky, Salmaan H. Baxamusa, Clint D. Frye, Ian Seth Ladner, Thomas M. Spinka, Devin Joseph Funaro, David Ryan Hobby, Caleb Del Anderson, Todd Bandhauer
  • SYSTEM AND METHOD FOR LASER DIODE ARRAY HAVING INTEGRATED MICROCHANNEL COOLING
    Publication number: 20220329048
    Abstract: The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.
    Type: Application
    Filed: April 9, 2021
    Publication date: October 13, 2022
    Inventors: Jack KOTOVSKY, Salmaan H. BAXAMUSA, Clint D. FRYE, Ian Seth LADNER, Thomas M. SPINKA, Devin Joseph FUNARO, David Ryan HOBBY, Caleb Del ANDERSON, Todd BANDHAUER
  • Cooling apparatus and methods of use
    Patent number: 10533809
    Abstract: Illustrative embodiments disclosed herein pertain to a cooling apparatus that includes a distributor plate and a conduit assembly. The conduit assembly allows a cooling fluid to flow downwards through a first set of holes in the distributor plate and onto a hot object placed below the distributor plate. The cooling fluid then flows upwards from the hot object into a second set of holes in the distributor plate. The first set of holes are shaped to offer a pressure increase to the cooling fluid flowing towards the hot object. The second set of holes are shaped to offer reduced resistance to the cooling fluid flowing away from the hot object. The distributor plate and the conduit assembly are fabricated from a material that is a heat insulator thereby preventing heat transfer from the cooling fluid flowing away from the hot object to the cooling fluid flowing towards the hot object.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: January 14, 2020
    Assignee: Keysight Technologies, Inc.
    Inventors: David Lionel Sherrer, Chris Richard Jacobsen, David Ryan Hobby, Todd Matthew Bandhauer
  • COOLING APPARATUS AND METHODS OF USE
    Publication number: 20200011620
    Abstract: Illustrative embodiments disclosed herein pertain to a cooling apparatus that includes a distributor plate and a conduit assembly. The conduit assembly allows a cooling fluid to flow downwards through a first set of holes in the distributor plate and onto a hot object placed below the distributor plate. The cooling fluid then flows upwards from the hot object into a second set of holes in the distributor plate. The first set of holes are shaped to offer a pressure increase to the cooling fluid flowing towards the hot object. The second set of holes are shaped to offer reduced resistance to the cooling fluid flowing away from the hot object. The distributor plate and the conduit assembly are fabricated from a material that is a heat insulator thereby preventing heat transfer from the cooling fluid flowing away from the hot object to the cooling fluid flowing towards the hot object.
    Type: Application
    Filed: July 6, 2018
    Publication date: January 9, 2020
    Inventors: David Lionel Sherrer, Chris Richard Jacobsen, David Ryan Hobby, Todd Matthew Bandhauer