Abstract: An electronic device has a housing and circuitry disposed within the housing. The circuitry is mounted to, for example, a top surface of a Printed Wiring Board (PWB) disposed within the housing. The PWB has a dual-height cavity that is formed as a recess in the top surface. The dual-height cavity is sized to receive one or more electronic components. Electrical contacts disposed within the dual-height cavity electrically connect the electronic component to electronic circuits mounted to the top surface of the PWB.

Abstract: The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules.

Abstract: The invention described herein provides a core modem assembly for a communication circuit that is well suited for mobile communication devices such as cellular phones, personal digital assistants, laptop computers, and hand-held computers. The core modem assembly comprises a baseband module, an RF module, and a socket connector that provides electrical isolation between the baseband module and RF module. The core modem assembly achieves a very small form factor and provides shielding between the baseband module and RF module. Further, the core modem assembly uses a “plug and play” design allowing late customization and interchangeability of the modules.

Abstract: The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules.

Abstract: A power amplifier circuit for a mobile terminal controls the bias voltage depending on the modulation of the input signal. The power amplifier circuit includes a power amplifier control circuit configured to control power amplifier bias for a first input signal modulation using calibrated bias control values corresponding to a range of transmit power levels, and to control power amplifier bias for said second input signal modulation using adjusted bias control values obtained by adding bias offsets to said calibrated bias control values.