Abstract: A gradient compensated temperature probe including a probe body and a temperature responsive element in the probe body at a measuring location couplable to a conventional temperature sensing circuit. The probe further includes a heating element spaced apart from the temperature responsive element for heating the probe to compensate for a temperature gradient along the probe. The probe further includes a bridge circuit, the legs of which each include a temperature dependent resistor located in the probe body between the heating element and the temperature responsive element. A comparator detects a temperature difference between the two temperature dependent resistors to control the application of power to the heating element to provide temperature gradient compensation for the probe.