Patents by Inventor David S. Chialastri

David S. Chialastri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluid cooling assembly for a computing system
    Patent number: 11853134
    Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: December 26, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Vincent W. Michna, David S. Chialastri, Nilashis Dey, Yasir Jamal
  • FLUID COOLING ASSEMBLY FOR A COMPUTING SYSTEM
    Publication number: 20230114466
    Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 13, 2023
    Inventors: Vincent W. Michna, David S. Chialastri, Nilashis Dey, Yasir Jamal