Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.

Abstract: A three axes MEM accelerometer system includes three MEM accelerometer sensors and a MEM sensor board including a MEM sensor control circuit for the accelerometer sensors. The accelerometer sensors are mounted mutually orthogonally. At least two coplanar mounting members have a first surface coplanar with a connection pad on the surface of the sensor board. A second surface is inclined to the surface of the board for mounting a MEM accelerometer sensor. An electrical conductor array interconnects the MEM accelerometer sensor with the connection pad on the board.

Abstract: A coplanar mounting member for a MEM sensor includes a first surface coplanar with a connection pad on the surface of a MEM sensor board containing the MEM sensor control circuit; a second surface inclined to the surface of the board for mounting a MEM sensor and an electrical conductor array for interconnecting the MEM sensor with the connection pad on the board.

Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.

Abstract: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.

Abstract: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.

Abstract: A coplanar mounting member for a MEM sensor includes a first surface coplanar with a connection pad on the surface of a MEM sensor board containing the MEM sensor control circuit; a second surface inclined to the surface of the board for mounting a MEM sensor and an electrical conductor array for interconnecting the MEM sensor with the connection pad on the board.

Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.

Abstract: An apparatus for mounting a portable detachable cup holder to the seat of a patron at a sporting event or other event such as a theater. In the first embodiment a loop end receives the cup to be held and has a rigid straight member with a depending U-shaped end clip. The end clip is shaped and sided to fit over the rear portion of the patron's seat and hold the rigid member and loop end thereto while the length of the rigid member is about the same as the width of the seat. In a second embodiment, the cup holding loop is mounted to an angled rigid member having its own second loop which second loop fits over an upright rim edge of the horizontal seat.