Patents by Inventor David S. Hartman

David S. Hartman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11986387
    Abstract: Described embodiments are directed toward centrally-opening leaflet prosthetic valve devices having a leaflet frame and a mechanically coupled leaflet. The described leaflet frames have projections that are configured to couple with a leaflet attachment region of a leaflet. Some embodiments include a leaflet retention feature that engages the leaflet frame projections and operates to secure the leaflet to the leaflet frame. Methods of making and using such prosthetic valve devices are also described.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: May 21, 2024
    Assignee: EDWARDS LIFESCIENCES CORPORATION
    Inventors: Dustin V. Dienno, Cody L. Hartman, Ryan S. Titone, David J. Arcaro, Roy Manygoats, Jr.
  • Patent number: 11974916
    Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods that include a prosthetic valve. The prosthetic valve may include a jacket configured to cover at least one of gaps, spaces, or interfaces in a frame or between one or more leaflets attached to the frame.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: May 7, 2024
    Assignee: Edwards Lifesciences Corporation
    Inventors: David J. Arcaro, Kyle W. Colavito, Dustin V. Dienno, Cody L. Hartman, Roy Manygoats, Jr., Ryan S. Titone, Ryan D. Smith, Joshua A. Sprinkle, Benjamin A. Smith, James L. Goepfrich, Michael J. Shepard
  • Patent number: 5070786
    Abstract: A munitions employing explosively formed penetrator warhead includes a microstrip antennae pattern on its concave face and is configured such that its presence does not impede or deleteriously affect the ability of the EFP to form into a molten armor-piercing projectile following detonation. The concave surface of the warhead serves as the conductive ground plane for the microstrip antennae and a dielectric layer having the microstrip antennae pattern formed on a first surface thereof is bonded to the warhead. A feedthrough which passes through an aperture near the edge of the warhead allows the antennae to be coupled to the transmit/receive electronics used along with the antennae to detonate the munitions upon its reaching a predetermined standoff distance from the armor surfaces of the target to be destroyed.
    Type: Grant
    Filed: September 26, 1990
    Date of Patent: December 10, 1991
    Assignee: Honeywell Inc.
    Inventors: David S. Hartman, Daniel F. Cheeseman