Abstract: A process for the production of a composition modulated alloy having a predetermined concentration is disclosed, in which alternating layers of at least two metals are successively deposited upon a substrate by electrodeposition, vacuum deposition, vapor deposition, or sputtering. The individual thicknesses of at least one metal's layers are varied in a predetermined manner. Pulsed galvanostatic electrodeposition using a tailored waveform is preferred. A copper-nickel concentration graded alloy is disclosed. Concentration graded alloys of predetermined concentration having at least one region of local homogeneity are also disclosed. The region of local homogeneity has a thickness corresponding to the thickness of two adjacent layers of different metals which have been diffusion annealed together. A pulsed electrodeposition/diffusion anneal process for production of such alloys is also disclosed.