Patents by Inventor David S. Lehtonen

David S. Lehtonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device having a molding compound including a composite material
    Patent number: 9293420
    Abstract: An electronic device includes a packaged integrated circuit having an integrated circuit die having an active surface, and a molding compound overlaying the active surface of the integrated circuit die. In a particular embodiment, the packaged integrated circuit includes at least approximately five weight percent (5 wt %) zinc relative to the molding compound. In another embodiment, the packaged integrated circuit includes approximately 0.3 ?mol/cm2 of zinc in an area parallel to the active surface of the integrated circuit die.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: March 22, 2016
    Assignee: Cypress Semiconductor Corporation
    Inventors: Adam D. Fogle, David S. Lehtonen, Richard Clark Blish, II
  • ELECTRONIC DEVICE HAVING A MOLDING COMPOUND INCLUDING A COMPOSITE MATERIAL
    Publication number: 20100327417
    Abstract: An electronic device includes a packaged integrated circuit having an integrated circuit die having an active surface, and a molding compound overlaying the active surface of the integrated circuit die. In a particular embodiment, the packaged integrated circuit includes at least approximately five weight percent (5 wt %) zinc relative to the molding compound. In another embodiment, the packaged integrated circuit includes approximately 0.3 ?mol/cm2 of zinc in an area parallel to the active surface of the integrated circuit die.
    Type: Application
    Filed: June 2, 2010
    Publication date: December 30, 2010
    Applicant: SPANSION LLC
    Inventors: Adam D. Fogle, David S. Lehtonen, Richard Clark Blish, II
  • Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection
    Patent number: 6751294
    Abstract: An apparatus for x-raying a semiconductor device which includes semiconductor material and conductive material, the apparatus including a source of x-rays, a filter for receiving x-rays from the source of x-rays and allowing transmission of x-rays to the device, the filter having an atomic number greater than the atomic number of the conductive material of the device, and an x-ray imager for receiving x-rays from the device.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: June 15, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Richard C. Blish II, Susan Xia Li, David S. Lehtonen, J. Courtney Black, Don C. Darling