Abstract: Embodiments of this present disclosure may include systems that perform operations including receiving a request to access data associated with an industrial automation device from a requesting device and identifying the industrial automation device based on the request. The operations may include sending a query for template data to the industrial automation device based on the request and receiving the template data. The operations may include determining a data structure based on the requesting device and generating the data structure based on the template data and a mapping between the data structure and the template data. The operations may additionally include sending the data structure to the requesting device.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: An industrial automation device includes first processing circuitry configured to perform a first set of operations associated with controlling the industrial automation device or one or more industrial automation devices communicatively coupled to the industrial automation device. The industrial automation device includes input/output circuitry communicatively couplable to an electronic device having second processing circuitry that is configured to execute computer-readable instructions to execute a software container and receive, in the software container, data from the industrial automation device, the one or more industrial automation devices, or both. The second processing circuitry executes the computer-readable instructions to perform, using the software container, a second set of operations associated with controlling the industrial automation device or the one or more industrial automation devices.

Abstract: A system may include temperature sensors configured to measure temperatures of devices within an industrial automation system. The devices may be disposed within enclosures separate from one or more spaces of an ambient space of the industrial automation system. The system may include thermal image sensors configured to acquire thermal imagery data associated with the ambient space. The system may include a processor configured to receive a first set of temperature data acquired by the temperature sensors over a period of time. The processor may further generate a second set of temperature data representative of one or more predicted temperatures associated with one or more additional spaces of the ambient space. The temperature model may represent expected temperatures of the one or more spaces with respect to the temperatures within the enclosures. The processor may generate a heat map visualization including one or more thermal indicators representative of the predicted temperatures.

Abstract: Various instrumentation, implants and methodology are disclosed for implanting bone implants in the TLIF approach. The implants are preferably cortical bone of various shapes. The instruments include chisels, rasps, trials, inserters, spreaders, adjustors, curettes, rongeurs, and impactors. The instruments have straight and bent shafts. The implants may have recesses or notches in their sides for receipt of a mating insertion instrument. Some of the implants have a threaded hole for receiving a mating threaded stud of an implant insertion instrument. The implants may have saw tooth vertebral gripping surfaces which are lordotic or parallel, may be C-shaped, multi-faceted or annular.