Patents by Inventor David S. Mui

David S. Mui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Etch pattern definition using a CVD organic layer as an anti-reflection coating and hardmask
    Publication number: 20080197109
    Abstract: A multilayer antireflective hard mask structure is disclosed. The structure comprises: (a) a CVD organic layer, wherein the CVD organic layer comprises carbon and hydrogen; and (b) a dielectric layer over the CVD organic layer. The dielectric layer is preferably a silicon oxynitride layer, while the CVD organic layer preferably comprises 70-80% carbon, 10-20% hydrogen and 5-15% nitrogen. Also disclosed are methods of forming and trimming such a multilayer antireflective hard mask structure. Further disclosed are methods of etching a substrate structure using a mask structure that contains a CVD organic layer and optionally has a dielectric layer over the CVD organic layer.
    Type: Application
    Filed: October 31, 2007
    Publication date: August 21, 2008
    Applicant: Applied Materials, Inc.
    Inventors: David S. Mui, Wei Liu, Thorsten Lill, Christopher Dennis Bencher, Yuxiang May Wang
  • Etch pattern definition using a CVD organic layer as an anti-reflection coating and hardmask
    Publication number: 20020086547
    Abstract: A multilayer antireflective hard mask structure is disclosed. The structure comprises: (a) a CVD organic layer, wherein the CVD organic layer comprises carbon and hydrogen; and (b) a dielectric layer over the CVD organic layer. The dielectric layer is preferably a silicon oxynitride layer, while the CVD organic layer preferably comprises 70-80% carbon, 10-20% hydrogen and 5-15% nitrogen. Also disclosed are methods of forming and trimming such a multilayer antireflective hard mask structure. Further disclosed are methods of etching a substrate structure using a mask structure that contains a CVD organic layer and optionally has a dielectric layer over the CVD organic layer.
    Type: Application
    Filed: July 13, 2001
    Publication date: July 4, 2002
    Applicant: Applied Materials, Inc.
    Inventors: David S. Mui, Wei Liu, Thorsten Lill, Christopher Dennis Bencher, Yuxiang May Wang